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readme update

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pull/3/head
Emard 6 years ago
parent df8154be45
commit 9b841adea0
1 changed files with 3 additions and 3 deletions
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README.md
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@ -288,7 +288,7 @@ Here is checklist what was done or should be done in the next PCB release.
[x] ADC: footprint according to MAX1112x land pattern 90-0023 [x] ADC: footprint according to MAX1112x land pattern 90-0023
[ ] fix tombstoning see https://www.tempoautomation.com/blog/surface-mount-tombstone-experiment/ [ ] fix tombstoning see https://www.tempoautomation.com/blog/surface-mount-tombstone-experiment/
[ ] Avoid VIAs on the PADs [ ] Avoid VIAs on the PADs
[ ] aligment marks for BGA footprint using exposed gold plated copper [x] aligment marks for BGA footprint using exposed gold plated copper
[ ] Order ADCs in reel (not bulk, not tube). [ ] Order ADCs in reel (not bulk, not tube).
[ ] check increased distance of 2 pad rows for SDRAM [x] check increased distance of 2 pad rows of SDRAM
[ ] check increased distance of 2 pad rows for FT231X [x] check decreased distance of 2 pad rows of FT231X

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