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added SDRAM TSOP-54 package

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pull/3/head
Davor 8 years ago
parent 090f666f1e
commit b20aaeb5c0
7 changed files with 252 additions and 83 deletions
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77
footprints/sdram/TSOP54.pretty/TSOP54.kicad_mod
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@ -0,0 +1,77 @@
(module TSOPII-54_10.16x22.22mm_Pitch0.8mm (layer F.Cu) (tedit 55BAC4E8)
(descr "TSOPII-54: Plastic Thin Small Outline Package; 54 leads; body width 10.16mm; (see 128m-as4c4m32s-tsopii.pdf and http://www.infineon.com/cms/packages/SMD_-_Surface_Mounted_Devices/P-PG-TSOPII/P-TSOPII-54-1.html)")
(tags "TSOPII 0.8")
(fp_text reference REF** (at 0 -12) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TSOPII-54_10.16x22.22mm_Pitch0.8mm (at 0 12) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -5.08 11.1) (end -5.08 10.9) (layer F.SilkS) (width 0.15))
(fp_line (start 5.08 11.1) (end 5.08 10.9) (layer F.SilkS) (width 0.15))
(fp_circle (center -4.25 -10.25) (end -4 -10.25) (layer F.SilkS) (width 0.15))
(fp_line (start -5.08 -10.9) (end -5.9 -10.9) (layer F.SilkS) (width 0.15))
(fp_line (start -5.08 -11.1) (end -5.08 -10.9) (layer F.SilkS) (width 0.15))
(fp_line (start 5.08 -11.1) (end 5.08 -10.9) (layer F.SilkS) (width 0.15))
(fp_line (start 5.08 11.11) (end -5.08 11.11) (layer F.SilkS) (width 0.15))
(fp_line (start -5.08 -11.11) (end 5.08 -11.11) (layer F.SilkS) (width 0.15))
(pad 28 smd rect (at 5.53 10.4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at -5.53 -10.4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -5.53 -9.6) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -5.53 -8.8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -5.53 -8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -5.53 -7.2) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -5.53 -6.4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -5.53 -5.6) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -5.53 -4.8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at -5.53 -4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -5.53 -3.2) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at -5.53 -2.4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at -5.53 -1.6) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at -5.53 -0.8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at -5.53 0) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at -5.53 0.8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at -5.53 1.6) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at -5.53 2.4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at -5.53 3.2) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at -5.53 4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at -5.53 4.8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at -5.53 5.6) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 22 smd rect (at -5.53 6.4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 23 smd rect (at -5.53 7.2) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 24 smd rect (at -5.53 8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 25 smd rect (at -5.53 8.8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 26 smd rect (at -5.53 9.6) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 27 smd rect (at -5.53 10.4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 29 smd rect (at 5.53 9.6) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 30 smd rect (at 5.53 8.8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 31 smd rect (at 5.53 8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 32 smd rect (at 5.53 7.2) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 33 smd rect (at 5.53 6.4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 34 smd rect (at 5.53 5.6) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 35 smd rect (at 5.53 4.8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 36 smd rect (at 5.53 4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 37 smd rect (at 5.53 3.2) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 38 smd rect (at 5.53 2.4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 39 smd rect (at 5.53 1.6) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 40 smd rect (at 5.53 0.8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 41 smd rect (at 5.53 0) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 42 smd rect (at 5.53 -0.8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 43 smd rect (at 5.53 -1.6) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 44 smd rect (at 5.53 -2.4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 45 smd rect (at 5.53 -3.2) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 46 smd rect (at 5.53 -4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 47 smd rect (at 5.53 -4.8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 48 smd rect (at 5.53 -5.6) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 49 smd rect (at 5.53 -6.4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 50 smd rect (at 5.53 -7.2) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 51 smd rect (at 5.53 -8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 52 smd rect (at 5.53 -8.8) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 53 smd rect (at 5.53 -9.6) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 54 smd rect (at 5.53 -10.4) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(model Housings_SSOP.3dshapes/TSOPII-54_10.16x22.22mm_Pitch0.8mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

1
fp-lib-table
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@ -7,4 +7,5 @@
(lib (name micro-sd)(type KiCad)(uri "$(KIPRJMOD)/footprints/micro-sd/micro-sd.pretty")(options "")(descr ""))
(lib (name usb_otg)(type KiCad)(uri "$(KIPRJMOD)/footprints/usb_otg/usb_otg.pretty")(options "")(descr ""))
(lib (name TSOT-25)(type KiCad)(uri "$(KIPRJMOD)/footprints/dcdc_converter/TSOT-25.pretty")(options "")(descr ""))
(lib (name TSOP54)(type KiCad)(uri "$(KIPRJMOD)/footprints/sdram/TSOP54.pretty")(options "")(descr ""))
)

11
ulx3s.bak
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@ -737,4 +737,15 @@ Wire Wire Line
2550 700 2550 750
Text Notes 7300 3450 0 60 ~ 0
OLED 1.3" PCB \n14x14 units\n1 unit = 2.54 mm
$Comp
L MT48LC16M4A2P IC1
U 1 1 58D5C787
P 9650 2100
F 0 "IC1" H 9050 3300 50 0000 C CNN
F 1 "MT48LC16M4A2P" H 10300 900 50 0000 C CNN
F 2 "Housings_SSOP:VSO-56_11.1x21.5mm_Pitch0.75mm" V 10050 2100 50 0000 C CIN
F 3 "" H 9650 1850 50 0000 C CNN
1 9650 2100
1 0 0 -1
$EndComp
$EndSCHEMATC

147
ulx3s.kicad_pcb
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@ -2658,91 +2658,80 @@
(net 84 BTN_F1))
)
(module Housings_SSOP:VSO-56_11.1x21.5mm_Pitch0.75mm (layer F.Cu) (tedit 57AF34A2) (tstamp 58D5C85C)
(module TSOP54:TSOP54 (layer F.Cu) (tedit 55BAC4E8) (tstamp 58D65464)
(at 144.25 84.595 180)
(descr "VSO56: plastic very small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf)")
(tags "SSOP 0.75")
(descr "TSOPII-54: Plastic Thin Small Outline Package; 54 leads; body width 10.16mm; (see 128m-as4c4m32s-tsopii.pdf and http://www.infineon.com/cms/packages/SMD_-_Surface_Mounted_Devices/P-PG-TSOPII/P-TSOPII-54-1.html)")
(tags "TSOPII 0.8")
(path /58D5C787)
(attr smd)
(fp_text reference IC1 (at 0 -11.825 180) (layer F.SilkS)
(fp_text reference IC1 (at 0 -12 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MT48LC16M4A2P (at 0 11.825 180) (layer F.Fab)
(fp_text value MT48LC16M4A2P (at 0 12 180) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -4.55 -10.75) (end 5.55 -10.75) (layer F.Fab) (width 0.15))
(fp_line (start 5.55 -10.75) (end 5.55 10.75) (layer F.Fab) (width 0.15))
(fp_line (start 5.55 10.75) (end -5.55 10.75) (layer F.Fab) (width 0.15))
(fp_line (start -5.55 10.75) (end -5.55 -9.75) (layer F.Fab) (width 0.15))
(fp_line (start -5.55 -9.75) (end -4.55 -10.75) (layer F.Fab) (width 0.15))
(fp_line (start -8.3 -11.1) (end -8.3 11.1) (layer F.CrtYd) (width 0.05))
(fp_line (start 8.3 -11.1) (end 8.3 11.1) (layer F.CrtYd) (width 0.05))
(fp_line (start -8.3 -11.1) (end 8.3 -11.1) (layer F.CrtYd) (width 0.05))
(fp_line (start -8.3 11.1) (end 8.3 11.1) (layer F.CrtYd) (width 0.05))
(fp_line (start -5.7 -10.9) (end -5.7 -10.65) (layer F.SilkS) (width 0.15))
(fp_line (start 5.7 -10.9) (end 5.7 -10.55) (layer F.SilkS) (width 0.15))
(fp_line (start 5.7 10.9) (end 5.7 10.55) (layer F.SilkS) (width 0.15))
(fp_line (start -5.7 10.9) (end -5.7 10.55) (layer F.SilkS) (width 0.15))
(fp_line (start -5.7 -10.9) (end 5.7 -10.9) (layer F.SilkS) (width 0.15))
(fp_line (start -5.7 10.9) (end 5.7 10.9) (layer F.SilkS) (width 0.15))
(fp_line (start -5.7 -10.65) (end -8.025 -10.65) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -7 -10.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -7 -9.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -7 -8.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -7 -7.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -7 -7.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -7 -6.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -7 -5.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -7 -4.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at -7 -4.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -7 -3.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at -7 -2.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at -7 -1.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at -7 -1.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at -7 -0.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at -7 0.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at -7 1.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at -7 1.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at -7 2.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at -7 3.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at -7 4.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at -7 4.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 22 smd rect (at -7 5.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 23 smd rect (at -7 6.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 24 smd rect (at -7 7.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 25 smd rect (at -7 7.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 26 smd rect (at -7 8.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 27 smd rect (at -7 9.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 28 smd rect (at -7 10.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 29 smd rect (at 7 10.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 30 smd rect (at 7 9.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 31 smd rect (at 7 8.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 32 smd rect (at 7 7.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 33 smd rect (at 7 7.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 34 smd rect (at 7 6.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 35 smd rect (at 7 5.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 36 smd rect (at 7 4.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 37 smd rect (at 7 4.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 38 smd rect (at 7 3.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 39 smd rect (at 7 2.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 40 smd rect (at 7 1.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 41 smd rect (at 7 1.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 42 smd rect (at 7 0.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 43 smd rect (at 7 -0.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 44 smd rect (at 7 -1.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 45 smd rect (at 7 -1.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 46 smd rect (at 7 -2.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 47 smd rect (at 7 -3.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 48 smd rect (at 7 -4.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 49 smd rect (at 7 -4.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 50 smd rect (at 7 -5.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 51 smd rect (at 7 -6.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 52 smd rect (at 7 -7.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 53 smd rect (at 7 -7.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 54 smd rect (at 7 -8.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 55 smd rect (at 7 -9.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 56 smd rect (at 7 -10.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(model Housings_SSOP.3dshapes/VSO-56_11.1x21.5mm_Pitch0.75mm.wrl
(fp_line (start -5.08 11.1) (end -5.08 10.9) (layer F.SilkS) (width 0.15))
(fp_line (start 5.08 11.1) (end 5.08 10.9) (layer F.SilkS) (width 0.15))
(fp_circle (center -4.25 -10.25) (end -4 -10.25) (layer F.SilkS) (width 0.15))
(fp_line (start -5.08 -10.9) (end -5.9 -10.9) (layer F.SilkS) (width 0.15))
(fp_line (start -5.08 -11.1) (end -5.08 -10.9) (layer F.SilkS) (width 0.15))
(fp_line (start 5.08 -11.1) (end 5.08 -10.9) (layer F.SilkS) (width 0.15))
(fp_line (start 5.08 11.11) (end -5.08 11.11) (layer F.SilkS) (width 0.15))
(fp_line (start -5.08 -11.11) (end 5.08 -11.11) (layer F.SilkS) (width 0.15))
(pad 28 smd rect (at 5.53 10.4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at -5.53 -10.4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -5.53 -9.6 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -5.53 -8.8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -5.53 -8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -5.53 -7.2 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -5.53 -6.4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -5.53 -5.6 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -5.53 -4.8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at -5.53 -4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -5.53 -3.2 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at -5.53 -2.4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at -5.53 -1.6 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at -5.53 -0.8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at -5.53 0 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at -5.53 0.8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at -5.53 1.6 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at -5.53 2.4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at -5.53 3.2 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at -5.53 4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at -5.53 4.8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at -5.53 5.6 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 22 smd rect (at -5.53 6.4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 23 smd rect (at -5.53 7.2 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 24 smd rect (at -5.53 8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 25 smd rect (at -5.53 8.8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 26 smd rect (at -5.53 9.6 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 27 smd rect (at -5.53 10.4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 29 smd rect (at 5.53 9.6 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 30 smd rect (at 5.53 8.8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 31 smd rect (at 5.53 8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 32 smd rect (at 5.53 7.2 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 33 smd rect (at 5.53 6.4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 34 smd rect (at 5.53 5.6 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 35 smd rect (at 5.53 4.8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 36 smd rect (at 5.53 4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 37 smd rect (at 5.53 3.2 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 38 smd rect (at 5.53 2.4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 39 smd rect (at 5.53 1.6 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 40 smd rect (at 5.53 0.8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 41 smd rect (at 5.53 0 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 42 smd rect (at 5.53 -0.8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 43 smd rect (at 5.53 -1.6 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 44 smd rect (at 5.53 -2.4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 45 smd rect (at 5.53 -3.2 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 46 smd rect (at 5.53 -4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 47 smd rect (at 5.53 -4.8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 48 smd rect (at 5.53 -5.6 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 49 smd rect (at 5.53 -6.4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 50 smd rect (at 5.53 -7.2 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 51 smd rect (at 5.53 -8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 52 smd rect (at 5.53 -8.8 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 53 smd rect (at 5.53 -9.6 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(pad 54 smd rect (at 5.53 -10.4 180) (size 0.9 0.56) (layers F.Cu F.Paste F.Mask))
(model Housings_SSOP.3dshapes/TSOPII-54_10.16x22.22mm_Pitch0.8mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))

93
ulx3s.kicad_pcb-bak
Unescape View File

@ -8,7 +8,7 @@
(drawings 20)
(tracks 1)
(zones 0)
(modules 40)
(modules 41)
(nets 89)
)
@ -2658,6 +2658,97 @@
(net 84 BTN_F1))
)
(module Housings_SSOP:VSO-56_11.1x21.5mm_Pitch0.75mm (layer F.Cu) (tedit 57AF34A2) (tstamp 58D5C85C)
(at 144.25 84.595 180)
(descr "VSO56: plastic very small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf)")
(tags "SSOP 0.75")
(path /58D5C787)
(attr smd)
(fp_text reference IC1 (at 0 -11.825 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MT48LC16M4A2P (at 0 11.825 180) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -4.55 -10.75) (end 5.55 -10.75) (layer F.Fab) (width 0.15))
(fp_line (start 5.55 -10.75) (end 5.55 10.75) (layer F.Fab) (width 0.15))
(fp_line (start 5.55 10.75) (end -5.55 10.75) (layer F.Fab) (width 0.15))
(fp_line (start -5.55 10.75) (end -5.55 -9.75) (layer F.Fab) (width 0.15))
(fp_line (start -5.55 -9.75) (end -4.55 -10.75) (layer F.Fab) (width 0.15))
(fp_line (start -8.3 -11.1) (end -8.3 11.1) (layer F.CrtYd) (width 0.05))
(fp_line (start 8.3 -11.1) (end 8.3 11.1) (layer F.CrtYd) (width 0.05))
(fp_line (start -8.3 -11.1) (end 8.3 -11.1) (layer F.CrtYd) (width 0.05))
(fp_line (start -8.3 11.1) (end 8.3 11.1) (layer F.CrtYd) (width 0.05))
(fp_line (start -5.7 -10.9) (end -5.7 -10.65) (layer F.SilkS) (width 0.15))
(fp_line (start 5.7 -10.9) (end 5.7 -10.55) (layer F.SilkS) (width 0.15))
(fp_line (start 5.7 10.9) (end 5.7 10.55) (layer F.SilkS) (width 0.15))
(fp_line (start -5.7 10.9) (end -5.7 10.55) (layer F.SilkS) (width 0.15))
(fp_line (start -5.7 -10.9) (end 5.7 -10.9) (layer F.SilkS) (width 0.15))
(fp_line (start -5.7 10.9) (end 5.7 10.9) (layer F.SilkS) (width 0.15))
(fp_line (start -5.7 -10.65) (end -8.025 -10.65) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -7 -10.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -7 -9.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -7 -8.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -7 -7.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -7 -7.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -7 -6.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -7 -5.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -7 -4.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at -7 -4.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -7 -3.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at -7 -2.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at -7 -1.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at -7 -1.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at -7 -0.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at -7 0.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at -7 1.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at -7 1.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at -7 2.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at -7 3.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at -7 4.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at -7 4.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 22 smd rect (at -7 5.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 23 smd rect (at -7 6.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 24 smd rect (at -7 7.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 25 smd rect (at -7 7.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 26 smd rect (at -7 8.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 27 smd rect (at -7 9.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 28 smd rect (at -7 10.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 29 smd rect (at 7 10.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 30 smd rect (at 7 9.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 31 smd rect (at 7 8.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 32 smd rect (at 7 7.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 33 smd rect (at 7 7.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 34 smd rect (at 7 6.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 35 smd rect (at 7 5.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 36 smd rect (at 7 4.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 37 smd rect (at 7 4.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 38 smd rect (at 7 3.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 39 smd rect (at 7 2.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 40 smd rect (at 7 1.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 41 smd rect (at 7 1.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 42 smd rect (at 7 0.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 43 smd rect (at 7 -0.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 44 smd rect (at 7 -1.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 45 smd rect (at 7 -1.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 46 smd rect (at 7 -2.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 47 smd rect (at 7 -3.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 48 smd rect (at 7 -4.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 49 smd rect (at 7 -4.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 50 smd rect (at 7 -5.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 51 smd rect (at 7 -6.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 52 smd rect (at 7 -7.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 53 smd rect (at 7 -7.875 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 54 smd rect (at 7 -8.625 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 55 smd rect (at 7 -9.375 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 56 smd rect (at 7 -10.125 180) (size 2.1 0.4) (layers F.Cu F.Paste F.Mask))
(model Housings_SSOP.3dshapes/VSO-56_11.1x21.5mm_Pitch0.75mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(gr_line (start 137.28 99.52) (end 137.28 63.96) (layer Eco2.User) (width 0.2))
(gr_line (start 172.84 99.52) (end 137.28 99.52) (layer Eco2.User) (width 0.2))
(gr_line (start 172.84 63.96) (end 172.84 99.52) (layer Eco2.User) (width 0.2))

4
ulx3s.net
Unescape View File

@ -1,7 +1,7 @@
(export (version D)
(design
(source /home/davor/tmp/ulx3s/ulx3s.sch)
(date "Sub 25 Ožu 2017 02:21:09")
(date "Sub 25 Ožu 2017 11:56:57")
(tool "Eeschema 4.0.5+dfsg1-4")
(sheet (number 1) (name /) (tstamps /)
(title_block
@ -141,7 +141,7 @@
(tstamp 58D5E6B8))
(comp (ref IC1)
(value MT48LC16M4A2P)
(footprint Housings_SSOP:VSO-56_11.1x21.5mm_Pitch0.75mm)
(footprint TSOP54:TSOP54)
(libsource (lib memory) (part MT48LC16M4A2P))
(sheetpath (names /) (tstamps /))
(tstamp 58D5C787))

2
ulx3s.sch
Unescape View File

@ -743,7 +743,7 @@ U 1 1 58D5C787
P 9650 2100
F 0 "IC1" H 9050 3300 50 0000 C CNN
F 1 "MT48LC16M4A2P" H 10300 900 50 0000 C CNN
F 2 "Housings_SSOP:VSO-56_11.1x21.5mm_Pitch0.75mm" V 10050 2100 50 0000 C CIN
F 2 "TSOP54:TSOP54" V 10050 2100 50 0000 C CIN
F 3 "" H 9650 1850 50 0000 C CNN
1 9650 2100
1 0 0 -1

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