readme update

6 years ago · c2035875d0
parent ad02cb0817
commit c2035875d0
1 changed files with 3 additions and 3 deletions
--- a/README.md
+++ b/README.md
@ -277,8 +277,8 @@ Here is checklist what was done or should be done in the next PCB release.
    [x] no paste on SW1 pads 
    [x] diode for BTN0 to PROGRAMN
    [x] capacitor for BTN0 debounce
-    [ ] BGA pad=0.4mm mask=0.5mm paste=0.35mm
+    [x] BGA pad=0.4mm mask=0.5mm paste=0.35mm
-    [ ] VIA align to 0.4mm raster
+    [x] VIA align to 0.4mm raster
-    [ ] min VIA enlarge 0.4 mm -> 0.419 mm
+    [x] min VIA enlarge 0.4 mm -> 0.419 mm