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PCB: antenna as test point

Browse Source
pull/3/head
davor 7 years ago
parent bd6c927106
commit d3b1eb567c
2 changed files with 226 additions and 215 deletions
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59
ulx3s.kicad_pcb
Unescape View File

@ -3,7 +3,7 @@
(general (general
(thickness 1.6) (thickness 1.6)
(drawings 483) (drawings 483)
(tracks 4806) (tracks 4805)
(zones 0) (zones 0)
(modules 206) (modules 206)
(nets 316) (nets 316)
@ -57,7 +57,7 @@
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(mod_text_size 1 1) (mod_text_size 1 1)
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(aux_axis_origin 94.1 112.22) (aux_axis_origin 94.1 112.22)
@ -972,21 +972,6 @@
) )
) )
(module SMD_Packages:1Pin (layer F.Cu) (tedit 59F891E7) (tstamp 59C3DCCD)
(at 182.67515 111.637626)
(descr "module 1 pin (ou trou mecanique de percage)")
(tags DEV)
(path /58D6BF46/59C3AE47)
(fp_text reference AE1 (at -3.236 3.798) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 433MHz (at 2.606 3.798) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(pad 1 smd rect (at 0 0) (size 0.5 0.5) (layers B.Cu F.Paste F.Mask)
(net 157 /usb/ANT_433MHz))
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 590C5C33) (module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 590C5C33)
(at 103.498 98.758 90) (at 103.498 98.758 90)
(descr "Resistor SMD 0603, hand soldering") (descr "Resistor SMD 0603, hand soldering")
@ -9972,6 +9957,27 @@
) )
) )
(module TestPoint:TestPoint_Pad_D1.0mm (layer B.Cu) (tedit 5AF2DD22) (tstamp 5B1F6F6F)
(at 182.888 111.603)
(descr "SMD pad as test Point, diameter 1.0mm")
(tags "test point SMD pad")
(path /58D6BF46/59C3AE47)
(attr virtual)
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(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
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(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user %R (at 0 1.45) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
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(fp_circle (center 0 0) (end 1 0) (layer B.CrtYd) (width 0.05))
(fp_circle (center 0 0) (end 0 -0.7) (layer B.SilkS) (width 0.12))
(pad 1 smd circle (at 0 0) (size 0.3 0.3) (layers B.Cu B.Mask)
(net 157 /usb/ANT_433MHz))
)
(gr_text 3.3V (at 133.739 64.359 270) (layer F.SilkS) (tstamp 5AB79336) (gr_text 3.3V (at 133.739 64.359 270) (layer F.SilkS) (tstamp 5AB79336)
(effects (font (size 1.5 1.5) (thickness 0.3))) (effects (font (size 1.5 1.5) (thickness 0.3)))
) )
@ -13763,6 +13769,15 @@
(segment (start 124.427011 96.498691) (end 124.427011 94.341309) (width 0.19) (layer B.Cu) (net 156)) (segment (start 124.427011 96.498691) (end 124.427011 94.341309) (width 0.19) (layer B.Cu) (net 156))
(via (at 125.110333 92.897638) (size 0.4) (drill 0.2) (layers F.Cu B.Cu) (net 156)) (via (at 125.110333 92.897638) (size 0.4) (drill 0.2) (layers F.Cu B.Cu) (net 156))
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(segment (start 123.557608 87.274371) (end 120.500164 90.331815) (width 0.3) (layer In2.Cu) (net 157))
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(segment (start 108.683 111.603) (end 182.605158 111.603) (width 0.3) (layer In2.Cu) (net 157))
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(via (at 182.888 111.603) (size 0.4) (drill 0.2) (layers F.Cu B.Cu) (net 157))
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(segment (start 124.561184 87.074372) (end 124.361185 87.274371) (width 0.3) (layer F.Cu) (net 157)) (segment (start 124.561184 87.074372) (end 124.361185 87.274371) (width 0.3) (layer F.Cu) (net 157))
(segment (start 125.564511 86.071045) (end 124.561184 87.074372) (width 0.3) (layer F.Cu) (net 157)) (segment (start 125.564511 86.071045) (end 124.561184 87.074372) (width 0.3) (layer F.Cu) (net 157))
@ -13770,18 +13785,8 @@
(segment (start 130.556544 85) (end 129.219111 86.337433) (width 0.3) (layer F.Cu) (net 157)) (segment (start 130.556544 85) (end 129.219111 86.337433) (width 0.3) (layer F.Cu) (net 157))
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(segment (start 128.355287 86.071045) (end 125.564511 86.071045) (width 0.3) (layer F.Cu) (net 157)) (segment (start 128.355287 86.071045) (end 125.564511 86.071045) (width 0.3) (layer F.Cu) (net 157))
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(segment (start 108.717626 111.637626) (end 107.08 110) (width 0.3) (layer In2.Cu) (net 157))
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(via (at 124.361184 87.27437) (size 0.4) (drill 0.2) (layers F.Cu B.Cu) (net 157)) (via (at 124.361184 87.27437) (size 0.4) (drill 0.2) (layers F.Cu B.Cu) (net 157))
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(segment (start 172.862905 73.073975) (end 172.862905 71.416462) (width 0.3) (layer F.Cu) (net 158)) (segment (start 172.862905 73.073975) (end 172.862905 71.416462) (width 0.3) (layer F.Cu) (net 158))

382
ulx3s.kicad_pcb-bak
Unescape View File

@ -57,7 +57,7 @@
(mod_edge_width 0.15) (mod_edge_width 0.15)
(mod_text_size 1 1) (mod_text_size 1 1)
(mod_text_width 0.15) (mod_text_width 0.15)
(pad_size 3.5 3.3) (pad_size 0.3 0.3)
(pad_drill 0) (pad_drill 0)
(pad_to_mask_clearance 0.05) (pad_to_mask_clearance 0.05)
(aux_axis_origin 94.1 112.22) (aux_axis_origin 94.1 112.22)
@ -972,21 +972,6 @@
) )
) )
(module SMD_Packages:1Pin (layer F.Cu) (tedit 59F891E7) (tstamp 59C3DCCD)
(at 182.67515 111.637626)
(descr "module 1 pin (ou trou mecanique de percage)")
(tags DEV)
(path /58D6BF46/59C3AE47)
(fp_text reference AE1 (at -3.236 3.798) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 433MHz (at 2.606 3.798) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(pad 1 smd rect (at 0 0) (size 0.5 0.5) (layers B.Cu F.Paste F.Mask)
(net 157 /usb/ANT_433MHz))
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 590C5C33) (module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 590C5C33)
(at 103.498 98.758 90) (at 103.498 98.758 90)
(descr "Resistor SMD 0603, hand soldering") (descr "Resistor SMD 0603, hand soldering")
@ -1025,49 +1010,6 @@
) )
) )
(module Diodes_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 59D564F6) (tstamp 59D3C50D)
(at 155.695 66.5 90)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
(path /56AC389C/56AC483B)
(attr smd)
(fp_text reference D51 (at 3.048 -2.159 90) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value STPS2L30AF (at 0 -2.6 90) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user %R (at 3.048 -2.159 90) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
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(fp_line (start -2.3 -1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end 2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start -4.5 1.75) (end 4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 1.75) (end 4.5 -1.75) (layer B.CrtYd) (width 0.05))
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(fp_line (start -0.64944 -0.00102) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -4.4 -1.65) (end 2.5 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start -4.4 1.65) (end 2.5 1.65) (layer B.SilkS) (width 0.12))
(pad 1 smd rect (at -2.5 0 90) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(pad 2 smd rect (at 2.5 0 90) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 3 /gpio/IN5V))
(model ${KISYS3DMOD}/Diodes_SMD.3dshapes/D_SMA.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 595B8F7A) (module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 595B8F7A)
(at 156.33 72.85 180) (at 156.33 72.85 180)
(descr "Resistor SMD 0603, hand soldering") (descr "Resistor SMD 0603, hand soldering")
@ -3782,135 +3724,6 @@
) )
) )
(module Diodes_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 58643398) (tstamp 59D3C39C)
(at 112.261 69.802)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
(path /58D6BF46/58D6C83A)
(attr smd)
(fp_text reference D8 (at -0.127 -2.286) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value STPS2L30AF (at 0 -2.6) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user %R (at 0 2.5) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -4.4 1.65) (end -4.4 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start 2.3 -1.5) (end -2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start -2.3 -1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end 2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start -4.5 1.75) (end 4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 1.75) (end 4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 -1.75) (end -4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -4.5 -1.75) (end -4.5 1.75) (layer B.CrtYd) (width 0.05))
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(fp_line (start -0.64944 0.79908) (end -0.64944 -0.80112) (layer B.Fab) (width 0.1))
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(fp_line (start -0.64944 -0.00102) (end 0.50118 -0.75032) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -4.4 -1.65) (end 2.5 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start -4.4 1.65) (end 2.5 1.65) (layer B.SilkS) (width 0.12))
(pad 1 smd rect (at -2.5 0) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(pad 2 smd rect (at 2.5 0) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 42 USB5V))
(model ${KISYS3DMOD}/Diodes_SMD.3dshapes/D_SMA.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Diodes_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 59D566C5) (tstamp 59D3C3A1)
(at 164.712 73.612 180)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
(path /58D6BF46/58D6C83C)
(attr smd)
(fp_text reference D9 (at 0 -2.413 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value STPS2L30AF (at 0.762 -2.286 180) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user %R (at 0 2.5 180) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
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(fp_line (start -2.3 -1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end 2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start -4.5 1.75) (end 4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 1.75) (end 4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 -1.75) (end -4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -4.5 -1.75) (end -4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -0.64944 -0.00102) (end -1.55114 -0.00102) (layer B.Fab) (width 0.1))
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(fp_line (start -0.64944 0.79908) (end -0.64944 -0.80112) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.75032) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 -0.75032) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -4.4 -1.65) (end 2.5 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start -4.4 1.65) (end 2.5 1.65) (layer B.SilkS) (width 0.12))
(pad 1 smd rect (at -2.5 0 180) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 17 "Net-(D9-Pad1)"))
(pad 2 smd rect (at 2.5 0 180) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(model ${KISYS3DMOD}/Diodes_SMD.3dshapes/D_SMA.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Diodes_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 59D564E8) (tstamp 59D3C512)
(at 160.14 66.5 270)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
(path /56AC389C/56AC4846)
(attr smd)
(fp_text reference D52 (at 2.921 1.778 270) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value STPS2L30AF (at 0 -2.6 270) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user %R (at -3.048 -3.048 270) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -4.4 1.65) (end -4.4 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start 2.3 -1.5) (end -2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start -2.3 -1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end 2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start -4.5 1.75) (end 4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 1.75) (end 4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 -1.75) (end -4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -4.5 -1.75) (end -4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -0.64944 -0.00102) (end -1.55114 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.00102) (end 1.4994 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 0.79908) (end -0.64944 -0.80112) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.75032) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 -0.75032) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -4.4 -1.65) (end 2.5 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start -4.4 1.65) (end 2.5 1.65) (layer B.SilkS) (width 0.12))
(pad 1 smd rect (at -2.5 0 270) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 4 /gpio/OUT5V))
(pad 2 smd rect (at 2.5 0 270) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(model ${KISYS3DMOD}/Diodes_SMD.3dshapes/D_SMA.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module lfe5bg381:BGA-381_pitch0.8mm_dia0.4mm (layer F.Cu) (tedit 59D4B869) (tstamp 58D8D57E) (module lfe5bg381:BGA-381_pitch0.8mm_dia0.4mm (layer F.Cu) (tedit 59D4B869) (tstamp 58D8D57E)
(at 138.48 87.8) (at 138.48 87.8)
(path /56AC389C/5A0783C9) (path /56AC389C/5A0783C9)
@ -9972,6 +9785,199 @@
) )
) )
(module Diode_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 58643398) (tstamp 5B1F957C)
(at 112.261 69.802)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
(path /58D6BF46/58D6C83A)
(attr smd)
(fp_text reference D8 (at -0.127 -2.286) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value STPS2L30AF (at 0 -2.6) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -4.4 1.65) (end 2.5 1.65) (layer B.SilkS) (width 0.12))
(fp_line (start -4.4 -1.65) (end 2.5 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start -0.64944 -0.00102) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 -0.75032) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.75032) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 0.79908) (end -0.64944 -0.80112) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.00102) (end 1.4994 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end -1.55114 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start -4.5 -1.75) (end -4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 -1.75) (end -4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 1.75) (end 4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -4.5 1.75) (end 4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 2.3 1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end 2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start -2.3 -1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 -1.5) (end -2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start -4.4 1.65) (end -4.4 -1.65) (layer B.SilkS) (width 0.12))
(fp_text user %R (at 0 2.5) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(pad 2 smd rect (at 2.5 0) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 42 USB5V))
(pad 1 smd rect (at -2.5 0) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Diode_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 58643398) (tstamp 5B1F9593)
(at 164.712 73.612 180)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
(path /58D6BF46/58D6C83C)
(attr smd)
(fp_text reference D9 (at 0 -2.413 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value STPS2L30AF (at 0.762 -2.286 180) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user %R (at 0 2.5 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -4.4 1.65) (end -4.4 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start 2.3 -1.5) (end -2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start -2.3 -1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end 2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start -4.5 1.75) (end 4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 1.75) (end 4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 -1.75) (end -4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -4.5 -1.75) (end -4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -0.64944 -0.00102) (end -1.55114 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.00102) (end 1.4994 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 0.79908) (end -0.64944 -0.80112) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.75032) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 -0.75032) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -4.4 -1.65) (end 2.5 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start -4.4 1.65) (end 2.5 1.65) (layer B.SilkS) (width 0.12))
(pad 1 smd rect (at -2.5 0 180) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 17 "Net-(D9-Pad1)"))
(pad 2 smd rect (at 2.5 0 180) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Diode_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 58643398) (tstamp 5B1F95AA)
(at 155.695 66.5 90)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
(path /56AC389C/56AC483B)
(attr smd)
(fp_text reference D51 (at 3.048 -2.159 90) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value STPS2L30AF (at 0 -2.6 90) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user %R (at 0 2.5 90) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -4.4 1.65) (end -4.4 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start 2.3 -1.5) (end -2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start -2.3 -1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end 2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start -4.5 1.75) (end 4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 1.75) (end 4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 -1.75) (end -4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -4.5 -1.75) (end -4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -0.64944 -0.00102) (end -1.55114 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.00102) (end 1.4994 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 0.79908) (end -0.64944 -0.80112) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.75032) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 -0.75032) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -4.4 -1.65) (end 2.5 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start -4.4 1.65) (end 2.5 1.65) (layer B.SilkS) (width 0.12))
(pad 1 smd rect (at -2.5 0 90) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(pad 2 smd rect (at 2.5 0 90) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 3 /gpio/IN5V))
(model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Diode_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 58643398) (tstamp 5B1F95C1)
(at 160.14 66.5 270)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
(path /56AC389C/56AC4846)
(attr smd)
(fp_text reference D52 (at 2.921 1.778 270) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value STPS2L30AF (at 0 -2.6 270) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -4.4 1.65) (end 2.5 1.65) (layer B.SilkS) (width 0.12))
(fp_line (start -4.4 -1.65) (end 2.5 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start -0.64944 -0.00102) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 -0.75032) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.75032) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 0.79908) (end -0.64944 -0.80112) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.00102) (end 1.4994 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end -1.55114 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start -4.5 -1.75) (end -4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 -1.75) (end -4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 1.75) (end 4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -4.5 1.75) (end 4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 2.3 1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end 2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start -2.3 -1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 -1.5) (end -2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start -4.4 1.65) (end -4.4 -1.65) (layer B.SilkS) (width 0.12))
(fp_text user %R (at 0 2.5 270) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(pad 2 smd rect (at 2.5 0 270) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(pad 1 smd rect (at -2.5 0 270) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 4 /gpio/OUT5V))
(model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module TestPoint:TestPoint_Pad_D1.0mm (layer B.Cu) (tedit 5AF2DD22) (tstamp 5B1F6F6F)
(at 182.67515 111.637626)
(descr "SMD pad as test Point, diameter 1.0mm")
(tags "test point SMD pad")
(path /58D6BF46/59C3AE47)
(attr virtual)
(fp_text reference AE1 (at 0 1.448) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 433MHz (at 0 -1.55) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user %R (at 0 1.45) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_circle (center 0 0) (end 1 0) (layer B.CrtYd) (width 0.05))
(fp_circle (center 0 0) (end 0 -0.7) (layer B.SilkS) (width 0.12))
(pad 1 smd circle (at 0 0) (size 0.3 0.3) (layers B.Cu B.Mask)
(net 157 /usb/ANT_433MHz))
)
(gr_text 3.3V (at 133.739 64.359 270) (layer F.SilkS) (tstamp 5AB79336) (gr_text 3.3V (at 133.739 64.359 270) (layer F.SilkS) (tstamp 5AB79336)
(effects (font (size 1.5 1.5) (thickness 0.3))) (effects (font (size 1.5 1.5) (thickness 0.3)))
) )

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