readme update

pull/3/head
Emard 6 years ago
parent 4c76c26cae
commit e00fba3647

@ -280,5 +280,6 @@ Here is checklist what was done or should be done in the next PCB release.
[x] BGA pad=0.4mm mask=0.5mm paste=0.35mm [x] BGA pad=0.4mm mask=0.5mm paste=0.35mm
[x] VIA align to 0.4mm raster [x] VIA align to 0.4mm raster
[x] min VIA enlarge 0.4 mm -> 0.419 mm [x] min VIA enlarge 0.4 mm -> 0.419 mm
[x] USB: copper fill keepout
[ ] ADC: new footprint pads clearance 8.0->8.7 mil, length 11.7->11.0 mil, fab: %R, silk: pin 1 mark

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