@ -2,11 +2,11 @@
(general
(links 563)
(no_connects 48 5)
(no_connects 563 )
(area 93.949999 61.269999 188.230001 112.370001)
(thickness 1.6)
(drawings 6)
(tracks 135 )
(tracks 0 )
(zones 0)
(modules 113)
(nets 206)
@ -1073,7 +1073,7 @@
)
(module LEDs:LED_0805 (layer F.Cu) (tedit 55BDE1C2) (tstamp 58D659BC)
(at 119.5 81.105 270)
(at 119.5 80.47 270)
(descr "LED 0805 smd package")
(tags "LED 0805 SMD")
(path /58D6547C/58D66570)
@ -1117,7 +1117,7 @@
)
(module LEDs:LED_0805 (layer F.Cu) (tedit 55BDE1C2) (tstamp 58D659C2)
(at 116.96 81.105 270)
(at 116.96 80.47 270)
(descr "LED 0805 smd package")
(tags "LED 0805 SMD")
(path /58D6547C/58D66620)
@ -1161,7 +1161,7 @@
)
(module LEDs:LED_0805 (layer F.Cu) (tedit 55BDE1C2) (tstamp 58D659C8)
(at 114.42 81.105 270)
(at 114.42 80.47 270)
(descr "LED 0805 smd package")
(tags "LED 0805 SMD")
(path /58D6547C/58D666C3)
@ -1205,7 +1205,7 @@
)
(module LEDs:LED_0805 (layer F.Cu) (tedit 55BDE1C2) (tstamp 58D659CE)
(at 111.88 81.105 270)
(at 111.88 80.47 270)
(descr "LED 0805 smd package")
(tags "LED 0805 SMD")
(path /58D6547C/58D66733)
@ -1249,7 +1249,7 @@
)
(module LEDs:LED_0805 (layer F.Cu) (tedit 55BDE1C2) (tstamp 58D659D4)
(at 109.34 81.105 270)
(at 109.34 80.47 270)
(descr "LED 0805 smd package")
(tags "LED 0805 SMD")
(path /58D6547C/58D6688F)
@ -1293,7 +1293,7 @@
)
(module LEDs:LED_0805 (layer F.Cu) (tedit 55BDE1C2) (tstamp 58D659DA)
(at 106.8 81.105 270)
(at 106.8 80.47 270)
(descr "LED 0805 smd package")
(tags "LED 0805 SMD")
(path /58D6547C/58D66895)
@ -1337,7 +1337,7 @@
)
(module LEDs:LED_0805 (layer F.Cu) (tedit 55BDE1C2) (tstamp 58D659E0)
(at 104.26 81.105 270)
(at 104.26 80.47 270)
(descr "LED 0805 smd package")
(tags "LED 0805 SMD")
(path /58D6547C/58D6689B)
@ -1381,7 +1381,7 @@
)
(module LEDs:LED_0805 (layer F.Cu) (tedit 55BDE1C2) (tstamp 58D659E6)
(at 101.72 81.105 270)
(at 101.72 80.47 270)
(descr "LED 0805 smd package")
(tags "LED 0805 SMD")
(path /58D6547C/58D668A1)
@ -1781,7 +1781,7 @@
)
(module SMD_Packages:SMD-1206_Pol (layer B.Cu) (tedit 0) (tstamp 58D6C684)
(at 165.22 72.85)
(at 164.331 72.85)
(path /58D6BF46/58D6C83A)
(attr smd)
(fp_text reference D8 (at 0 0) (layer B.SilkS)
@ -1811,13 +1811,13 @@
)
(module SMD_Packages:SMD-1206_Pol (layer B.Cu) (tedit 0) (tstamp 58D6C68A)
(at 170.3 75.39 180 )
(at 153.79 103.965 )
(path /58D6BF46/58D6C83C)
(attr smd)
(fp_text reference D9 (at 0 0 180 ) (layer B.SilkS)
(fp_text reference D9 (at 0 0) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 2A (at 0 0 180 ) (layer B.Fab)
(fp_text value 2A (at 0 0) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -2.54 1.143) (end -2.794 1.143) (layer B.SilkS) (width 0.15))
@ -1829,9 +1829,9 @@
(fp_line (start 2.54 1.143) (end 2.54 -1.143) (layer B.SilkS) (width 0.15))
(fp_line (start 2.54 -1.143) (end 0.889 -1.143) (layer B.SilkS) (width 0.15))
(fp_line (start -0.889 1.143) (end -2.54 1.143) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -1.651 0 180 ) (size 1.524 2.032) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -1.651 0) (size 1.524 2.032) (layers B.Cu B.Paste B.Mask)
(net 21 "Net-(D9-Pad1)"))
(pad 2 smd rect (at 1.651 0 180 ) (size 1.524 2.032) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 1.651 0) (size 1.524 2.032) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(model SMD_Packages.3dshapes/SMD-1206_Pol.wrl
(at (xyz 0 0 0))
@ -1841,14 +1841,14 @@
)
(module Power_Integrations:SO-8 (layer B.Cu) (tedit 0) (tstamp 58D70A05)
(at 164.585 93.17 18 0)
(at 171.57 95.075 27 0)
(descr "SO-8 Surface Mount Small Outline 150mil 8pin Package")
(tags "Power Integrations D Package")
(path /58D51CAD/58D70684)
(fp_text reference U7 (at 0 0 18 0) (layer B.SilkS)
(fp_text reference U7 (at 0 0 27 0) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value PCF8523 (at 0 0 18 0) (layer B.Fab)
(fp_text value PCF8523 (at 0 0 27 0) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_circle (center -1.905 -0.762) (end -1.778 -0.762) (layer B.SilkS) (width 0.15))
@ -1857,32 +1857,32 @@
(fp_line (start -2.54 -1.905) (end 2.54 -1.905) (layer B.SilkS) (width 0.15))
(fp_line (start -2.54 -1.905) (end -2.54 1.905) (layer B.SilkS) (width 0.15))
(fp_line (start 2.54 -1.905) (end 2.54 1.905) (layer B.SilkS) (width 0.15))
(pad 1 smd oval (at -1.905 -2.794 18 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask)
(pad 1 smd oval (at -1.905 -2.794 27 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask)
(net 34 /power/OSCI_32k))
(pad 2 smd oval (at -0.635 -2.794 18 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask)
(pad 2 smd oval (at -0.635 -2.794 27 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask)
(net 35 /power/OSCO_32k))
(pad 3 smd oval (at 0.635 -2.794 18 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask)
(pad 3 smd oval (at 0.635 -2.794 27 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask)
(net 22 /power/VBAT))
(pad 4 smd oval (at 1.905 -2.794 18 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask)
(pad 4 smd oval (at 1.905 -2.794 27 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 5 smd oval (at 1.905 2.794 18 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask))
(pad 6 smd oval (at 0.635 2.794 18 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask))
(pad 7 smd oval (at -0.635 2.794 18 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask)
(pad 5 smd oval (at 1.905 2.794 27 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask))
(pad 6 smd oval (at 0.635 2.794 27 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask))
(pad 7 smd oval (at -0.635 2.794 27 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask)
(net 28 /power/WAKEUPn))
(pad 8 smd oval (at -1.905 2.794 18 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask)
(pad 8 smd oval (at -1.905 2.794 27 0) (size 0.6096 1.4732) (layers B.Cu B.Paste B.Mask)
(net 16 +2V5))
)
(module Capacitors_SMD:C_0805_HandSoldering (layer B.Cu) (tedit 541A9B8D) (tstamp 58D79A6F)
(at 161.41 91.9 180 )
(at 163.315 92.535 )
(descr "Capacitor SMD 0805, hand soldering")
(tags "capacitor 0805")
(path /58D51CAD/58D7A3F0)
(attr smd)
(fp_text reference C13 (at 0 2.1 180 ) (layer B.SilkS)
(fp_text reference C13 (at 0 2.1) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 2.2uF (at 0 -2.1 180 ) (layer B.Fab)
(fp_text value 2.2uF (at 0 -2.1) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -1 -0.625) (end -1 0.625) (layer B.Fab) (width 0.15))
@ -1895,9 +1895,9 @@
(fp_line (start 2.3 1) (end 2.3 -1) (layer B.CrtYd) (width 0.05))
(fp_line (start 0.5 0.85) (end -0.5 0.85) (layer B.SilkS) (width 0.15))
(fp_line (start -0.5 -0.85) (end 0.5 -0.85) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -1.25 0 180 ) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -1.25 0) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(pad 2 smd rect (at 1.25 0 180 ) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
(net 29 /power/WKUP))
(model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
(at (xyz 0 0 0))
@ -1907,7 +1907,7 @@
)
(module Diodes_SMD:D_0805 (layer B.Cu) (tedit 574BBB4C) (tstamp 58D79A7B)
(at 157.058 91.9 )
(at 158.235 91.265 )
(descr "Diode SMD in 0805 package")
(tags "smd diode")
(path /58D51CAD/58D79CB5)
@ -1941,7 +1941,7 @@
)
(module Diodes_SMD:D_0805 (layer B.Cu) (tedit 574BBB4C) (tstamp 58D79A81)
(at 174.33 93.17 )
(at 180.48 88 )
(descr "Diode SMD in 0805 package")
(tags "smd diode")
(path /58D51CAD/58D7CBDC)
@ -2009,15 +2009,15 @@
)
(module Diodes_SMD:D_0805 (layer B.Cu) (tedit 574BBB4C) (tstamp 58D7A84D)
(at 172.84 88.09 9 0)
(at 166.905 77.295 18 0)
(descr "Diode SMD in 0805 package")
(tags "smd diode")
(path /58D51CAD/58D7BC4A)
(attr smd)
(fp_text reference D12 (at 0 -1.6 9 0) (layer B.SilkS)
(fp_text reference D12 (at 0 -1.6 18 0) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 1N4148 (at 0 1.6 9 0) (layer B.Fab)
(fp_text value 1N4148 (at 0 1.6 18 0) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -1.8 -0.9) (end -1.8 0.9) (layer B.CrtYd) (width 0.05))
@ -2036,9 +2036,9 @@
(fp_line (start -1 0.6) (end 1 0.6) (layer B.Fab) (width 0.15))
(fp_line (start -1.1 -0.7) (end 0.7 -0.7) (layer B.SilkS) (width 0.15))
(fp_line (start -1.1 0.7) (end 0.7 0.7) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -1.05 0 9 0) (size 0.8 0.9) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -1.05 0 18 0) (size 0.8 0.9) (layers B.Cu B.Paste B.Mask)
(net 18 /power/PWREN))
(pad 2 smd rect (at 1.05 0 9 0) (size 0.8 0.9) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 1.05 0 18 0) (size 0.8 0.9) (layers B.Cu B.Paste B.Mask)
(net 36 FTDI_nSUSPEND))
)
@ -2173,7 +2173,7 @@
)
(module TSOP54:TSOP54 (layer F.Cu) (tedit 55BAC4E8) (tstamp 58D85778)
(at 163.95 84.28 90)
(at 163.315 83.01 90)
(descr "TSOPII-54: Plastic Thin Small Outline Package; 54 leads; body width 10.16mm; (see 128m-as4c4m32s-tsopii.pdf and http://www.infineon.com/cms/packages/SMD_-_Surface_Mounted_Devices/P-PG-TSOPII/P-TSOPII-54-1.html)")
(tags "TSOPII 0.8")
(path /58D6D507/58D8506F)
@ -2775,7 +2775,7 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58D8ED91)
(at 170.3 77.93 180)
(at 162.68 77.295 180)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D6BF46/58EBA6BD)
@ -3303,7 +3303,7 @@
)
(module lfe5bg381:BGA-381_pitch0.8mm_dia0.4mm (layer F.Cu) (tedit 58D8FE92) (tstamp 58D8D57E)
(at 140.68 85 )
(at 138.08 87.2 )
(path /56AC389C/56AC4242)
(attr smd)
(fp_text reference U1 (at -7.6 -9.2) (layer F.SilkS)
@ -3466,7 +3466,7 @@
(pad D16 smd circle (at 4.4 -5.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 87 /gpio/D16) (solder_mask_margin 0.04))
(pad D17 smd circle (at 5.2 -5.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 136 SDRAM_D15) ( solder_mask_margin 0.04))
(solder_mask_margin 0.04))
(pad D18 smd circle (at 6 -5.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 137 SDRAM_BA1) (solder_mask_margin 0.04))
(pad D19 smd circle (at 6.8 -5.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
@ -3504,9 +3504,9 @@
(pad E15 smd circle (at 3.6 -4.4) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 91 /gpio/E15) (solder_mask_margin 0.04))
(pad E16 smd circle (at 4.4 -4.4) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 140 SDRAM_CLK) ( solder_mask_margin 0.04))
(solder_mask_margin 0.04))
(pad E17 smd circle (at 5.2 -4.4) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 141 SDRAM_D13) ( solder_mask_margin 0.04))
(solder_mask_margin 0.04))
(pad E18 smd circle (at 6 -4.4) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 142 SDRAM_BA0) (solder_mask_margin 0.04))
(pad E19 smd circle (at 6.8 -4.4) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
@ -3544,9 +3544,9 @@
(pad F15 smd circle (at 3.6 -3.6) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 16 +2V5) (solder_mask_margin 0.04))
(pad F16 smd circle (at 4.4 -3.6) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 145 SDRAM_D14) ( solder_mask_margin 0.04))
(solder_mask_margin 0.04))
(pad F17 smd circle (at 5.2 -3.6) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 146 SDRAM_A11) ( solder_mask_margin 0.04))
(solder_mask_margin 0.04))
(pad F18 smd circle (at 6 -3.6) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 147 SDRAM_D12) (solder_mask_margin 0.04))
(pad F19 smd circle (at 6.8 -3.6) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
@ -3584,7 +3584,7 @@
(pad G15 smd circle (at 3.6 -2.8) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 1 GND) (solder_mask_margin 0.04))
(pad G16 smd circle (at 4.4 -2.8) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 150 SDRAM_A10) ( solder_mask_margin 0.04))
(solder_mask_margin 0.04))
(pad G17 smd circle (at 5.2 -2.8) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 1 GND) (solder_mask_margin 0.04))
(pad G18 smd circle (at 6 -2.8) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
@ -3624,9 +3624,9 @@
(pad H15 smd circle (at 3.6 -2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3) (solder_mask_margin 0.04))
(pad H16 smd circle (at 4.4 -2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 154 SDRAM_D10) ( solder_mask_margin 0.04))
(solder_mask_margin 0.04))
(pad H17 smd circle (at 5.2 -2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 155 SDRAM_D9) ( solder_mask_margin 0.04))
(solder_mask_margin 0.04))
(pad H18 smd circle (at 6 -2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 156 SDRAM_A9) (solder_mask_margin 0.04))
(pad H19 smd circle (at 6.8 -2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
@ -3664,9 +3664,9 @@
(pad J15 smd circle (at 3.6 -1.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3) (solder_mask_margin 0.04))
(pad J16 smd circle (at 4.4 -1.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 158 SDRAM_D8) ( solder_mask_margin 0.04))
(solder_mask_margin 0.04))
(pad J17 smd circle (at 5.2 -1.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 159 SDRAM_A8) ( solder_mask_margin 0.04))
(solder_mask_margin 0.04))
(pad J18 smd circle (at 6 -1.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 160 SDRAM_A2) (solder_mask_margin 0.04))
(pad J19 smd circle (at 6.8 -1.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
@ -3750,9 +3750,9 @@
(pad L18 smd circle (at 6 0.4) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(pad L19 smd circle (at 6.8 0.4) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(net 159 SDRAM_A8) ( solder_mask_margin 0.04))
(pad L20 smd circle (at 7.6 0.4) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(net 168 SDRAM_nRAS) ( solder_mask_margin 0.04))
(pad M1 smd circle (at -7.6 1.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 187 AUDIO_L1) (solder_mask_margin 0.04))
(pad M2 smd circle (at -6.8 1.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
@ -3788,11 +3788,11 @@
(pad M17 smd circle (at 5.2 1.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(pad M18 smd circle (at 6 1.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(net 136 SDRAM_D15) ( solder_mask_margin 0.04))
(pad M19 smd circle (at 6.8 1.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(net 166 SDRAM_DQM0) ( solder_mask_margin 0.04))
(pad M20 smd circle (at 7.6 1.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(net 169 SDRAM_DQM1) ( solder_mask_margin 0.04))
(pad N1 smd circle (at -7.6 2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 188 AUDIO_L0) (solder_mask_margin 0.04))
(pad N2 smd circle (at -6.8 2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
@ -3826,13 +3826,13 @@
(pad N16 smd circle (at 4.4 2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(pad N17 smd circle (at 5.2 2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(net 49 SD_CMD) ( solder_mask_margin 0.04))
(pad N18 smd circle (at 6 2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(pad N19 smd circle (at 6.8 2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 51 SD_D0) (solder_mask_margin 0.04))
(pad N19 smd circle (at 6.8 2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 150 SDRAM_A10) (solder_mask_margin 0.04))
(pad N20 smd circle (at 7.6 2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(net 158 SDRAM_D8) ( solder_mask_margin 0.04))
(pad P1 smd circle (at -7.6 2.8) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 189 AUDIO_R3) (solder_mask_margin 0.04))
(pad P2 smd circle (at -6.8 2.8) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
@ -3868,9 +3868,9 @@
(pad P17 smd circle (at 5.2 2.8) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(pad P18 smd circle (at 6 2.8) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(net 141 SDRAM_D13) ( solder_mask_margin 0.04))
(pad P19 smd circle (at 6.8 2.8) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 49 SD_CMD ) (solder_mask_margin 0.04))
(net 140 SDRAM_CLK ) (solder_mask_margin 0.04))
(pad P20 smd circle (at 7.6 2.8) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(pad R1 smd circle (at -7.6 3.6) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
@ -3884,11 +3884,11 @@
(pad R5 smd circle (at -4.4 3.6) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 24 JTAG_TDI) (solder_mask_margin 0.04))
(pad R16 smd circle (at 4.4 3.6) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(net 50 SD_CLK) ( solder_mask_margin 0.04))
(pad R17 smd circle (at 5.2 3.6) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(net 52 SD_D1) ( solder_mask_margin 0.04))
(pad R18 smd circle (at 6 3.6) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(net 154 SDRAM_D10) ( solder_mask_margin 0.04))
(pad R19 smd circle (at 6.8 3.6) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 1 GND) (solder_mask_margin 0.04))
(pad R20 smd circle (at 7.6 3.6) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
@ -3926,13 +3926,13 @@
(pad T16 smd circle (at 4.4 4.4) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(pad T17 smd circle (at 5.2 4.4) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 166 SDRAM_DQM0) (solder_mask_margin 0.04))
(pad T18 smd circle (at 6 4.4) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(pad T18 smd circle (at 6 4.4) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 155 SDRAM_D9) (solder_mask_margin 0.04))
(pad T19 smd circle (at 6.8 4.4) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 167 SDRAM_nCS) (solder_mask_margin 0.04))
(net 171 SDRAM_nWE ) (solder_mask_margin 0.04))
(pad T20 smd circle (at 7.6 4.4) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 50 SD_CLK ) (solder_mask_margin 0.04))
(net 167 SDRAM_nCS ) (solder_mask_margin 0.04))
(pad U1 smd circle (at -7.6 5.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(pad U2 smd circle (at -6.8 5.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
@ -3964,15 +3964,15 @@
(pad U15 smd circle (at 3.6 5.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(pad U16 smd circle (at 4.4 5.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 168 SDRAM_nRAS) ( solder_mask_margin 0.04))
(solder_mask_margin 0.04))
(pad U17 smd circle (at 5.2 5.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 169 SDRAM_DQM1) ( solder_mask_margin 0.04))
(solder_mask_margin 0.04))
(pad U18 smd circle (at 6 5.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 170 SDRAM_nCAS ) (solder_mask_margin 0.04))
(net 146 SDRAM_A11 ) (solder_mask_margin 0.04))
(pad U19 smd circle (at 6.8 5.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 171 SDRAM_nWE ) (solder_mask_margin 0.04))
(net 170 SDRAM_nCAS ) (solder_mask_margin 0.04))
(pad U20 smd circle (at 7.6 5.2) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(net 52 SD_D1) (solder_mask_margin 0.04))
(net 14 5 SDRAM _D14 ) (solder_mask_margin 0.04))
(pad V1 smd circle (at -7.6 6) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.04))
(pad V2 smd circle (at -6.8 6) (size 0.35 0.35) (layers F.Cu F.Paste F.Mask)
@ -4167,7 +4167,7 @@
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer B.Cu) (tedit 54130A77) (tstamp 58D911E2)
(at 113.15 77.29 5)
(at 111.245 76.02 5)
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /58D913EC/58D913F5)
@ -4218,7 +4218,7 @@
)
(module Capacitors_SMD:C_0603_HandSoldering (layer B.Cu) (tedit 541A9B4D) (tstamp 58D91CFD)
(at 155.06 102.06 180)
(at 156.33 101.425 180)
(descr "Capacitor SMD 0603, hand soldering")
(tags "capacitor 0603")
(path /58D686D9/58D92807)
@ -4251,15 +4251,15 @@
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer B.Cu) (tedit 54130A77) (tstamp 58D91D27)
(at 153.79 98.25 )
(at 153.79 96.345 90 )
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /58D686D9/58D91A1E)
(attr smd)
(fp_text reference U11 (at 0 3.5) (layer B.SilkS)
(fp_text reference U11 (at 0 3.5 90 ) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value PCA9306DCTR (at 0 -3.5) (layer B.Fab)
(fp_text value PCA9306DCTR (at 0 -3.5 90 ) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -0.95 2.45) (end 1.95 2.45) (layer B.Fab) (width 0.15))
@ -4278,21 +4278,21 @@
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer B.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer B.SilkS) (width 0.15))
(fp_line (start -2.075 2.525) (end -3.475 2.525) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -2.7 1.905 90 ) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 2 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at -2.7 0.635 90 ) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(pad 3 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(pad 3 smd rect (at -2.7 -0.635 90 ) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 46 GPDI_SCL))
(pad 4 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(pad 4 smd rect (at -2.7 -1.905 90 ) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 45 GPDI_SDA))
(pad 5 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(pad 5 smd rect (at 2.7 -1.905 90 ) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 44 GPDI_5V_SDA))
(pad 6 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(pad 6 smd rect (at 2.7 -0.635 90 ) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 43 GPDI_5V_SCL))
(pad 7 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(pad 7 smd rect (at 2.7 0.635 90 ) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 47 /gpdi/VREF2))
(pad 8 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(pad 8 smd rect (at 2.7 1.905 90 ) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 47 /gpdi/VREF2))
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
@ -4302,15 +4302,15 @@
)
(module Diodes_SMD:D_0805 (layer B.Cu) (tedit 574BBB4C) (tstamp 58DA2737)
(at 161.41 94.44 )
(at 164.585 95.075 180 )
(descr "Diode SMD in 0805 package")
(tags "smd diode")
(path /58D51CAD/58DA2DA9)
(attr smd)
(fp_text reference D13 (at 0 -1.6) (layer B.SilkS)
(fp_text reference D13 (at 0 -1.6 180 ) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 1N4148 (at 0 1.6) (layer B.Fab)
(fp_text value 1N4148 (at 0 1.6 180 ) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -1.8 -0.9) (end -1.8 0.9) (layer B.CrtYd) (width 0.05))
@ -4329,9 +4329,9 @@
(fp_line (start -1 0.6) (end 1 0.6) (layer B.Fab) (width 0.15))
(fp_line (start -1.1 -0.7) (end 0.7 -0.7) (layer B.SilkS) (width 0.15))
(fp_line (start -1.1 0.7) (end 0.7 0.7) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -1.05 0) (size 0.8 0.9) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -1.05 0 180 ) (size 0.8 0.9) (layers B.Cu B.Paste B.Mask)
(net 29 /power/WKUP))
(pad 2 smd rect (at 1.05 0) (size 0.8 0.9) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 1.05 0 180 ) (size 0.8 0.9) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
)
@ -4887,7 +4887,7 @@
)
(module oled:oled_13xx (layer F.Cu) (tedit 58E6C585) (tstamp 58E6CF98)
(at 137.28 99.52 180)
(at 137.28 102.06 180)
(descr "SPI OLED 0.96\"")
(tags "SPI OLED socket strip")
(path /58D6547C/58E6D4AC)
@ -5112,15 +5112,15 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58E7970D)
(at 149.345 95.075 )
(at 151.885 101.425 180 )
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D686D9/58D92D93)
(attr smd)
(fp_text reference R22 (at 0 1.9) (layer B.SilkS)
(fp_text reference R22 (at 0 1.9 180 ) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 2.2k (at 0 -1.9) (layer B.Fab)
(fp_text value 2.2k (at 0 -1.9 180 ) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1))
@ -5133,9 +5133,9 @@
(fp_line (start 2 0.8) (end 2 -0.8) (layer B.CrtYd) (width 0.05))
(fp_line (start 0.5 -0.675) (end -0.5 -0.675) (layer B.SilkS) (width 0.15))
(fp_line (start -0.5 0.675) (end 0.5 0.675) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -1.1 0) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -1.1 0 180 ) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(pad 2 smd rect (at 1.1 0) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 1.1 0 180 ) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
(net 45 GPDI_SDA))
(model Resistors_SMD.3dshapes/R_0603_HandSoldering.wrl
(at (xyz 0 0 0))
@ -5145,7 +5145,7 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58E79712)
(at 148.71 98. 25 90)
(at 148.71 101.4 25 90)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D686D9/58D92CF9)
@ -5178,7 +5178,7 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58E79717)
(at 158.87 99.52 90)
(at 157.6 97.615 90)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D686D9/58D92136)
@ -5211,7 +5211,7 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58E7971C)
(at 160.14 98.2 5 90)
(at 159.505 97.61 5 90)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D686D9/58D921DD)
@ -5244,15 +5244,15 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58E79721)
(at 161.41 96.98 9 0)
(at 153.155 91.265 18 0)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D686D9/58D92237)
(attr smd)
(fp_text reference R26 (at 0 1.9 9 0) (layer B.SilkS)
(fp_text reference R26 (at 0 1.9 18 0) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 470 (at 0 -1.9 9 0) (layer B.Fab)
(fp_text value 470 (at 0 -1.9 18 0) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1))
@ -5265,9 +5265,9 @@
(fp_line (start 2 0.8) (end 2 -0.8) (layer B.CrtYd) (width 0.05))
(fp_line (start 0.5 -0.675) (end -0.5 -0.675) (layer B.SilkS) (width 0.15))
(fp_line (start -0.5 0.675) (end 0.5 0.675) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -1.1 0 9 0) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -1.1 0 18 0) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(pad 2 smd rect (at 1.1 0 9 0) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 1.1 0 18 0) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
(net 44 GPDI_5V_SDA))
(model Resistors_SMD.3dshapes/R_0603_HandSoldering.wrl
(at (xyz 0 0 0))
@ -5277,7 +5277,7 @@
)
(module Housings_SSOP:SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 57AFAF80) (tstamp 58EB6259)
(at 156.584 74.628 90)
(at 157.08 72.215 90)
(descr "SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)")
(tags "SSOP 0.65")
(path /58D6BF46/58EB61C6)
@ -5349,7 +5349,7 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58EC0519)
(at 108.07 77.93 90)
(at 106.165 76.66 90)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D913EC/58EC4E77)
@ -5382,7 +5382,7 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58EC051F)
(at 120.135 77.93 90)
(at 120.135 76.66 90)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D913EC/58EC4E85)
@ -5415,7 +5415,7 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58EC0525)
(at 118.23 77.93 90)
(at 118.23 76.66 90)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D913EC/58EC0EFE)
@ -5448,7 +5448,7 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58EC052B)
(at 112.515 83.01 180)
(at 113.15 81.105 180)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D913EC/58EC0F8E)
@ -5481,15 +5481,15 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58EC0531)
(at 117.595 81.105 18 0)
(at 116.325 76.66 9 0)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D913EC/58EC15E1)
(attr smd)
(fp_text reference R29 (at 0 1.9 18 0) (layer B.SilkS)
(fp_text reference R29 (at 0 1.9 9 0) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 1k (at 0 -1.9 18 0) (layer B.Fab)
(fp_text value 1k (at 0 -1.9 9 0) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -0.8 -0.4) (end -0.8 0.4) (layer B.Fab) (width 0.1))
@ -5502,9 +5502,9 @@
(fp_line (start 2 0.8) (end 2 -0.8) (layer B.CrtYd) (width 0.05))
(fp_line (start 0.5 -0.675) (end -0.5 -0.675) (layer B.SilkS) (width 0.15))
(fp_line (start -0.5 0.675) (end 0.5 0.675) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -1.1 0 18 0) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -1.1 0 9 0) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(pad 2 smd rect (at 1.1 0 18 0) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 1.1 0 9 0) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
(net 176 /flash/FLASH_SCK))
(model Resistors_SMD.3dshapes/R_0603_HandSoldering.wrl
(at (xyz 0 0 0))
@ -5514,7 +5514,7 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58EC0537)
(at 112.515 81.10 5 180)
(at 113.15 79.83 5 180)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D913EC/58EC1C84)
@ -5547,7 +5547,7 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58EC053D)
(at 134.74 95.71 90)
(at 139.82 107.14 90)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D913EC/58EC68DC)
@ -5580,7 +5580,7 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58EC0543)
(at 132.2 95.71 90)
(at 137.28 107.14 90)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D913EC/58EC68EA)
@ -5613,7 +5613,7 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58EC0549)
(at 129.66 95.71 90)
(at 134.74 107.14 90)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D913EC/58EC72FD)
@ -5679,7 +5679,7 @@
)
(module abs25:Crystal_SMD_ABS25 (layer B.Cu) (tedit 58D83518) (tstamp 58EDF633)
(at 175.38 98.25 )
(at 179.19 94 )
(descr "Abracon ABS25 Plastic SMD Crystal http://www.abracon.com/Resonators/abs25.pdf")
(tags "plastic smd crystal")
(path /58D51CAD/58D85AAB)
@ -5716,15 +5716,15 @@
)
(module oscxo:Crystal_SMD_7050_4Pads (layer B.Cu) (tedit 58EE0D05) (tstamp 58EE1137)
(at 111.88 71.58 )
(at 111.88 67.77 270 )
(descr "Crystal oscillator, 7.0x5.0mm, 4 Pads")
(tags "crystal oscillator quartz SMD SMT 7050")
(path /58D686D9/58EDFF94)
(attr smd)
(fp_text reference Y1 (at 0 4) (layer B.SilkS)
(fp_text reference Y1 (at 0 4 270 ) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value FNETHE025 (at 0 -4) (layer B.Fab)
(fp_text value FNETHE025 (at 0 -4 270 ) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -3.5 -2.5) (end -3.5 2.5) (layer B.Fab) (width 0.15))
@ -5745,18 +5745,18 @@
(fp_line (start -3.6 -0.2) (end -3.6 0.2) (layer B.SilkS) (width 0.15))
(fp_line (start 4.75 -3.1) (end -4.75 -3.1) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.75 3.1) (end 4.75 -3.1) (layer B.CrtYd) (width 0.05))
(pad 1 smd rect (at -3.15 -1.25) (size 2.2 1.4) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -3.15 -1.25 270 ) (size 2.2 1.4) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(pad 2 smd rect (at 3.15 -1.25) (size 2.2 1.4) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 3.15 -1.25 270 ) (size 2.2 1.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 3 smd rect (at 3.15 1.25) (size 2.2 1.4) (layers B.Cu B.Paste B.Mask)
(pad 3 smd rect (at 3.15 1.25 270 ) (size 2.2 1.4) (layers B.Cu B.Paste B.Mask)
(net 205 /gpdi/CLK_25MHz))
(pad 4 smd rect (at -3.15 1.25) (size 2.2 1.4) (layers B.Cu B.Paste B.Mask)
(pad 4 smd rect (at -3.15 1.25 270 ) (size 2.2 1.4) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
)
(module Socket_Strips:Socket_Strip_Straight_2x01 (layer F.Cu) (tedit 54E9F973) (tstamp 58EE2151)
(at 129.66 104.6 90)
(at 129.66 107.1 4 90)
(descr "Through hole socket strip")
(tags "socket strip")
(path /58D6D447/58EE29FF)
@ -5817,140 +5817,4 @@
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