PCB: "inam" logo update

ulx3s.kicad_pcb

@@ -753,6 +753,20 @@
     (uvia_drill 0.1)
   )
 
+  (module inem:inem (layer B.Cu) (tedit 5B1A682A) (tstamp 5B248F4A)
+    (at 128.913 65.883)
+    (fp_text reference REF** (at 0 -1.6) (layer B.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
+    )
+    (fp_text value inem (at 0 1.6) (layer B.Fab) hide
+      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
+    )
+    (fp_text user inem (at 0 0.1) (layer B.SilkS)
+      (effects (font (size 1.5 1.5) (thickness 0.3)) (justify mirror))
+    )
+    (fp_circle (center 0 0) (end 3 0) (layer B.SilkS) (width 0.3))
+  )
+
   (module fer:fer4mm6 (layer F.Cu) (tedit 5B1A6576) (tstamp 5B25673B)
     (at 159.901 64.994)
     (descr FER)
@@ -835,20 +849,6 @@
     )
   )
 
-  (module inem:inem (layer B.Cu) (tedit 5B190D59) (tstamp 5B248F4A)
-    (at 128.913 65.883)
-    (fp_text reference REF** (at 0 -1.6) (layer B.SilkS) hide
-      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
-    )
-    (fp_text value inem (at 0 1.6) (layer B.Fab) hide
-      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
-    )
-    (fp_text user inem (at 0 0) (layer B.SilkS)
-      (effects (font (size 1.5 1.5) (thickness 0.3)) (justify mirror))
-    )
-    (fp_circle (center 0 0) (end 3 0) (layer B.SilkS) (width 0.15))
-  )
-
   (module Socket_Strips:Socket_Strip_Angled_2x20 (layer F.Cu) (tedit 5A2B354F) (tstamp 58E6BE3D)
     (at 97.91 62.69 270)
     (descr "Through hole socket strip")
@@ -15753,7 +15753,7 @@
   (segment (start 177.3 91.043) (end 178.998 91.043) (width 0.3) (layer B.Cu) (net 316))
   (segment (start 178.998 91.043) (end 179.078 90.963) (width 0.3) (layer B.Cu) (net 316))
 
-  (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B26E31E) (hatch edge 0.508)
+  (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B1A70F5) (hatch edge 0.508)
     (connect_pads (clearance 0.254))
     (min_thickness 0.254)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -17619,7 +17619,7 @@
       )
     )
   )
-  (zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B26E31B) (hatch edge 0.508)
+  (zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B1A70F2) (hatch edge 0.508)
     (connect_pads (clearance 0.127))
     (min_thickness 0.254)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -17685,7 +17685,7 @@
       )
     )
   )
-  (zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B26E318) (hatch edge 0.508)
+  (zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B1A70EF) (hatch edge 0.508)
     (connect_pads (clearance 0.127))
     (min_thickness 0.1)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -18875,7 +18875,7 @@
       )
     )
   )
-  (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B26E315) (hatch edge 0.508)
+  (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B1A70EC) (hatch edge 0.508)
     (connect_pads (clearance 0.254))
     (min_thickness 0.254)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -19994,7 +19994,7 @@
       )
     )
   )
-  (zone (net 264) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B26E312) (hatch edge 0.508)
+  (zone (net 264) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1A70E9) (hatch edge 0.508)
     (connect_pads (clearance 0.127))
     (min_thickness 0.127)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -20245,7 +20245,7 @@
       )
     )
   )
-  (zone (net 172) (net_name +1V1) (layer In1.Cu) (tstamp 5B26E30F) (hatch edge 0.508)
+  (zone (net 172) (net_name +1V1) (layer In1.Cu) (tstamp 5B1A70E6) (hatch edge 0.508)
     (connect_pads (clearance 0.127))
     (min_thickness 0.254)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -20322,7 +20322,7 @@
       )
     )
   )
-  (zone (net 264) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B26E30C) (hatch edge 0.508)
+  (zone (net 264) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1A70E3) (hatch edge 0.508)
     (connect_pads (clearance 0.127))
     (min_thickness 0.127)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -20486,7 +20486,7 @@
       )
     )
   )
-  (zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B26E309) (hatch edge 0.508)
+  (zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B1A70E0) (hatch edge 0.508)
     (connect_pads (clearance 0.127))
     (min_thickness 0.127)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))

ulx3s.kicad_pcb-bak

@@ -11,10 +11,10 @@
 
   (page A4)
   (layers
-    (0 F.Cu signal hide)
-    (1 In1.Cu signal hide)
-    (2 In2.Cu signal hide)
-    (31 B.Cu signal hide)
+    (0 F.Cu signal)
+    (1 In1.Cu signal)
+    (2 In2.Cu signal)
+    (31 B.Cu signal)
     (32 B.Adhes user)
     (33 F.Adhes user)
     (34 B.Paste user)