readme update

pull/3/head
Emard 6 years ago
parent c14d0effb3
commit f2c2ff7c82

@ -285,5 +285,5 @@ Here is checklist what was done or should be done in the next PCB release.
[x] VIA align to 0.4mm raster [x] VIA align to 0.4mm raster
[x] min VIA enlarge 0.4 mm -> 0.419 mm [x] min VIA enlarge 0.4 mm -> 0.419 mm
[x] USB: copper fill keepout [x] USB: copper fill keepout
[x] ADC: new footprint according to MAX1112x packaing information [x] ADC: footprint according to MAX1112x land pattern 90-0023

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