|
|
@ -285,5 +285,5 @@ Here is checklist what was done or should be done in the next PCB release.
|
|
|
|
[x] VIA align to 0.4mm raster
|
|
|
|
[x] VIA align to 0.4mm raster
|
|
|
|
[x] min VIA enlarge 0.4 mm -> 0.419 mm
|
|
|
|
[x] min VIA enlarge 0.4 mm -> 0.419 mm
|
|
|
|
[x] USB: copper fill keepout
|
|
|
|
[x] USB: copper fill keepout
|
|
|
|
[x] ADC: new footprint according to MAX1112x packaing information
|
|
|
|
[x] ADC: footprint according to MAX1112x land pattern 90-0023
|
|
|
|
|
|
|
|
|
|
|
|