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footprints: MAX1112x footprint dimensions improved according to packaging information

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pull/3/head
Emard 6 years ago
parent e67da73514
commit f8b23d7b67
1 changed files with 73 additions and 0 deletions
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footprints/adc/max1112x-tqfn28.pretty/MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm.kicad_mod
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(module max1112x-tqfn28:MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm (layer F.Cu) (tedit 5B8FE9AB)
(descr "28-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN or VQFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "TQFN 0.5")
(attr smd)
(fp_text reference U8 (at 0 -3.875) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MAX11125 (at 0 3.875) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.5 -2.5) (end 2.5 -2.5) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 -2.5) (end 2.5 2.5) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 2.5) (end -2.5 2.5) (layer F.Fab) (width 0.15))
(fp_line (start -2.5 2.5) (end -2.5 -1.5) (layer F.Fab) (width 0.15))
(fp_line (start -2.5 -1.5) (end -1.5 -2.5) (layer F.Fab) (width 0.15))
(fp_line (start -3.15 -3.15) (end -3.15 3.15) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.15 -3.15) (end 3.15 3.15) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 -3.15) (end 3.15 -3.15) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 3.15) (end 3.15 3.15) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.625 -2.625) (end 2.625 -1.875) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 2.625) (end -2.625 1.875) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.625) (end 2.625 1.875) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 -2.625) (end -1.875 -2.625) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 2.625) (end -1.875 2.625) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.625) (end 1.875 2.625) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 -2.625) (end 1.875 -2.625) (layer F.SilkS) (width 0.15))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center -2.3 -3.1496) (end -2.2 -3.1496) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 -2.625) (end -2.9 -2.9) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.45 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.45 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.45 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.45 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.45 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.45 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -2.45 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -1.5 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at -1 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -0.5 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 0 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 0.5 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 1 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 1.5 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at 2.45 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.45 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 2.45 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at 2.45 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at 2.45 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at 2.45 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at 2.45 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 22 smd rect (at 1.5 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 23 smd rect (at 1 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 24 smd rect (at 0.5 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 25 smd rect (at 0 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 26 smd rect (at -0.5 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 27 smd rect (at -1 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 28 smd rect (at -1.5 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 29 smd rect (at 0.8125 0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at 0.8125 -0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at -0.8125 0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at -0.8125 -0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
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