Emard
|
106dce5b39
|
footprints: SDRAM pad length 1.1->1.2 mm
|
6 years ago |
|
Emard
|
3acab2e27e
|
footprints: rounded pads for PCB jumpers
|
6 years ago |
|
Emard
|
b92a15489b
|
footprints: BGA rename fiducial pads 0->X (as 0 is usually gnd)
|
6 years ago |
|
Emard
|
c322f6029d
|
footprints: ADC moving dot to better visible location (pin-1 marker)
|
6 years ago |
|
Emard
|
18379d51a8
|
footprints: BGA with fiducial pads for chip alignment
|
6 years ago |
|
Emard
|
47a0e3576a
|
footprints: ft231x reduce distance of 2 rows to 5.4 mm
|
6 years ago |
|
Emard
|
b8251359ae
|
footprints: ft231x enlarged silkscreen outline
|
6 years ago |
|
Emard
|
09e6053392
|
footprints: SDRAM pads enlarged length 0.9->1.1 mm, square->oval and
moved away from chip by 0.2 mm for easier handsoldering
|
6 years ago |
|
Emard
|
2336a24ab5
|
footprints: adc silkscreen cosmetix
|
6 years ago |
|
Emard
|
d261114e21
|
footprints: dipswitch silkscreen cosmetix
|
6 years ago |
|
Emard
|
8b24b6e4f6
|
footprints: adc silkscreen cosmetix: moving the dot
|
6 years ago |
|
Emard
|
94357f52b7
|
footprints: oval pads for ADC and USBSERIAL, only pad 1 squared
usbserial pads enlarged by 0.1mm towards the chip
|
6 years ago |
|
Emard
|
131bd8391e
|
footprints: max1112x pads distance reduced to 4.68 mm according to land pattern 90-0023
|
6 years ago |
|
Emard
|
f8b23d7b67
|
footprints: MAX1112x footprint dimensions improved according to packaging information
|
6 years ago |
|
Emard
|
7d9c40b7b8
|
footprints, PCB: dipswitch footprint moved to directory "footprints/dipswitch/dipswitch_smd.pretty"
|
6 years ago |
|
Emard
|
10ad82899b
|
footprints: fixing for Fab layer
|
6 years ago |
|
Emard
|
0bc3844449
|
footprints: fixing fab layer for assembly layout printed on paper sheet
|
6 years ago |
|
Emard
|
87c896a0bb
|
footprints: BGA pads 0.4mm copper, 0.5mm soldermask, 0.35mm paste=stencil
|
6 years ago |
|
Emard
|
186c9793f8
|
BGA footprint with design rules according to Lattice Recommendations
|
6 years ago |
|
Emard
|
cee659aa96
|
footprints: remove stray solder paste blob from GPDI1 connector
|
6 years ago |
|
Emard
|
809d0524c6
|
footprints: remove paste from ESP32 pads, it will be manually soldered later.
|
6 years ago |
|
davor
|
844444ca57
|
footprints: Solder paste for GPDI1 THT holes only on the SMD pad side (Front side)
|
6 years ago |
|
davor
|
e2f6b0c00f
|
footprints: solder paste removed from PCB jumpers and added to THT holes of GPDI1 connector
|
6 years ago |
|
Emard
|
ccc6c48bb3
|
footprints: hrvatski_grb (currently empty, a placeholder)
|
6 years ago |
|
Emard
|
11d67cecb2
|
footprints: koncar logo updated
|
6 years ago |
|
Emard
|
b05863e534
|
footprints: svg convertsion tool for the logo (only Koncar works)
|
6 years ago |
|
Emard
|
79b2d3dcab
|
footprints: Normally closed jumpers for 0805 and SMA
|
6 years ago |
|
Emard
|
7111716526
|
footprints: remove button directory because the same content was
already in pushbutton directory
|
6 years ago |
|
davor
|
3315823108
|
footprints: local dipswitch footprint
|
6 years ago |
|
davor
|
8c9ef55f0a
|
footprints: local 3D button PTS645 (missing in latest kicad 3d library)
|
6 years ago |
|
davor
|
c7565d5ebf
|
footprints: 3D model for molex 47219-2001
|
7 years ago |
|
davor
|
2fdb54786c
|
footprints: rotating battery holder 90 deg to match Harwin track and reel information
schematics: Battery holder PN and datasheet update
|
7 years ago |
|
Emard
|
5fe9914375
|
footprints: ESP-WROOM32 with description
|
7 years ago |
|
Emard
|
e547643803
|
footprints: USB description
|
7 years ago |
|
Emard
|
58c3d51cb5
|
footprints: SDRAM description
|
7 years ago |
|
Emard
|
1a24aae167
|
footprints: HDMI-D with description
|
7 years ago |
|
Emard
|
7cff1957a7
|
schematics v1.8.12
|
7 years ago |
|
Emard
|
f3678ad994
|
footprints: update audio jack symbol
|
7 years ago |
|
Emard
|
ca229e9f5d
|
footprints: descriptive audio jack schematic symbol
|
7 years ago |
|
Emard
|
831f646f0c
|
footprints: USB small pads version for FCI 10118192-0001LF updated
|
7 years ago |
|
Emard
|
98dceebdff
|
footprints: sdram silkscren with semicircle mark for pin 1
|
7 years ago |
|
Emard
|
3f95a31c8d
|
footprints: silkscren cosmetix smaller semicircle for SOIC-8 pin 1 marking
|
7 years ago |
|
Emard
|
ca79d902cf
|
footprints: improve visibility of pin 1 at SOIC-8 packages,
avoid writing silkscreen over the pads
|
7 years ago |
|
davor
|
88f951525f
|
footprints: "inem" update (font y-centering)
|
7 years ago |
|
davor
|
bf28d14518
|
footprints: "inem" logo circle with same thickness as letters
|
7 years ago |
|
davor
|
7bdb1880da
|
PCB: larger FER logo (4.6 mm height)
|
7 years ago |
|
Emard
|
2fec188b33
|
footprints: KONCAR logo
|
7 years ago |
|
Emard
|
c8a0440c9a
|
footprints: USB-MICRO-B-FCI-10118192-0001LF updated (THT->SMD)
|
7 years ago |
|
Emard
|
b6c5f0c059
|
footprints: MOLEX Micro-USB footprint
|
7 years ago |
|
davor
|
76ce6ab13b
|
footprints: combo 150/208 mil footprint for wider choice of flash chips
|
7 years ago |
