Emard
|
acb0a3d0ab
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
b9dbffc24d
|
gerbers update
|
6 years ago |
|
Emard
|
6a0c0ab47f
|
PCB: silkscreen block for handwritten notes
|
6 years ago |
|
Emard
|
4a0309ef58
|
gerbers update
|
6 years ago |
|
Emard
|
3021028ff5
|
PCB: trac cosmetix, routing BTN_R around to allow more BGA GND VIAs
|
6 years ago |
|
Emard
|
d99b484728
|
gerbers: trac cosmetix
|
6 years ago |
|
Emard
|
6d07a69129
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
685dbb01b3
|
gerbers update
|
6 years ago |
|
Emard
|
893f23e27c
|
PCB: add more VIAs under BGA
|
6 years ago |
|
Emard
|
d159872c39
|
pic v2.0.9
|
6 years ago |
|
Emard
|
854f71bdda
|
PCB: FPGA again set as visible in 3D view
|
6 years ago |
|
Emard
|
ca1d1bb1b4
|
gerbers v2.0.9
|
6 years ago |
|
Emard
|
676837ef3d
|
PCB v2.0.9: trac/via cosmetix
|
6 years ago |
|
Emard
|
f7dbe05a86
|
gerbers v2.0.8
|
6 years ago |
|
Emard
|
91b435bdfa
|
PCB v2.0.8: removing fill GND top layer under BGA, trac cosmetix
|
6 years ago |
|
Emard
|
728c4c63db
|
gerbers update
|
6 years ago |
|
Emard
|
ca91d6bb34
|
PCB: reducing copper traces on top layer under BGA to 0.127 mm
|
6 years ago |
|
Emard
|
628cfc36a0
|
gerbers update
|
6 years ago |
|
Emard
|
26ea73e434
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
8254f6b1bf
|
pic v2.0.7
|
6 years ago |
|
Emard
|
42cd91b0af
|
gerbers v2.0.7
|
6 years ago |
|
Emard
|
3aa8344fe6
|
PCB v2.0.7
|
6 years ago |
|
Emard
|
1899935077
|
schematics v2.0.7
|
6 years ago |
|
Emard
|
6c4868a752
|
PCB: thicker under SD card 0.127 -> 0.19 mm
|
6 years ago |
|
Emard
|
f18467c4a7
|
PCB: thicker USB_FPGA 0.127 -> 0.19 mm
|
6 years ago |
|
Emard
|
89a8f56097
|
PCB: thicker GPN0-27 0.127 -> 0.19 mm
|
6 years ago |
|
Emard
|
d6ccd6d60c
|
PCB: thicker to LEDs 0.127 -> 0.19 mm
|
6 years ago |
|
Emard
|
2709e5df41
|
PCB: thicker traces (0.5 mm) to 2.54 mm connectors J1, J2, SDRAM 0.127 -> 0.19 mm
|
6 years ago |
|
Emard
|
5e928d9e7f
|
schematics: change P-N in GPN11,12,13 for easier wifi routing
|
6 years ago |
|
Emard
|
f3cd6335a2
|
PCB: enlarging BGA vias to 0.419 mm, DRC passed, need trac cosmetix
|
6 years ago |
|
Emard
|
c98ea8dcdc
|
PCB: net class enlarged VIA diameter 0.4 -> 0.419 mm
|
6 years ago |
|
Emard
|
8d85bf2d47
|
PCB: thinner BGA traces 0.19 -> 0.127 mm (5 mil), DRC passed
|
6 years ago |
|
Emard
|
c942bf5a60
|
PCB: aligning VIAs under BGA to 0.4 mm raster
|
6 years ago |
|
Emard
|
ac500e7ca9
|
BGA pads increased to 0.4mm but VIAs remain the same
|
6 years ago |
|
Emard
|
acaf1fc5d3
|
readme: todo enlarge BGA pads align VIA to BGA raster
|
6 years ago |
|
Emard
|
8dd4311d72
|
PCB: reduced clearance 0.127->0.1 mm to accept BGA slightly larger pads
|
6 years ago |
|
Emard
|
186c9793f8
|
BGA footprint with design rules according to Lattice Recommendations
|
6 years ago |
|
Emard
|
321f82dc86
|
BGA layout updated with refernce to lattice document
TN1074: PCB Layout Recommendations for BGA Packages
|
6 years ago |
|
Emard
|
5a6e8fd91d
|
BOM update
|
7 years ago |
|
Emard
|
0131ac8882
|
PCB: C60 (B0 debouncer) smaller footprint 0805->0603, trac cosmetix
|
7 years ago |
|
Emard
|
d0e01b6022
|
schematics: C60 (B0 debouncer) smaller capacitor 2.2uF->220nF, note PWRBTn to PROGRAMN
|
7 years ago |
|
Emard
|
889a2f59da
|
readme update
|
7 years ago |
|
Emard
|
a5a4b267e7
|
PCB v2.0.6: debouncing capacitor for B0
|
7 years ago |
|
Emard
|
8ef7e6ed88
|
schematics v2.0.6: debouncing capacitor for B0
|
7 years ago |
|
Emard
|
971724e308
|
readme update
|
7 years ago |
|
Emard
|
ab9aaef519
|
pic update v2.0.5
|
7 years ago |
|
Emard
|
fac2994b7a
|
schematics v2.0.5: NOP change, comments about PROGRAMN not connected on v1.7
|
7 years ago |
|
Emard
|
b66ea05f8d
|
gerbers v2.0.5 trac cosmetix, spacing D28 D29
|
7 years ago |
|
Emard
|
3eb0c4ba4e
|
PCB v2.0.5 trac cosmetix, spacing D28 D29
|
7 years ago |
|
Emard
|
3b2b8eaea4
|
gerbers update
|
7 years ago |
