davor
|
bc88a6e2ae
|
PCB: silkscreen SW1 moved to visible position and similar cosmetics
|
7 years ago |
|
davor
|
ce6ee9ea3d
|
PCB: silkscreen cosmetics
|
7 years ago |
|
davor
|
6f74d5170e
|
PCB: use new footprint for Y1
|
7 years ago |
|
davor
|
27f6b96d3b
|
PCB: v1.7.3 SD card footprint centered, CD pins to GND
|
7 years ago |
|
Emard
|
42455ba7b0
|
PCB: use 3D model for SD card
|
7 years ago |
|
Emard
|
7d9309cc21
|
PCB: use new 2D footprint ABS25 with pin 1 mark for Y2
|
7 years ago |
|
Emard
|
c4f5429eca
|
PCB: use new abs25 3D model
|
7 years ago |
|
davor
|
fb3b02d103
|
PCB: dipswitch 3D update
|
7 years ago |
|
davor
|
abc824a998
|
PCB: correct 3D shape for SDRAM chip
|
7 years ago |
|
davor
|
6c7902e963
|
PCB: update SW1 pins renumbering and orientation
|
7 years ago |
|
davor
|
0277b4009b
|
SMD dipswitch model converted to VRML (dipswitch_smd.wrl)
and included in 3D viewer. scale and orientation is wrong,
currently fixed in PCB 3D model parameters
|
7 years ago |
|
Emard
|
da99fe090b
|
schematics: imported netlist from schematics. no phyiscal layout change.
|
7 years ago |
|
Emard
|
dd642d0578
|
PCB: wider SDRAM footprint and trac cosmetix
|
7 years ago |
|
Emard
|
36b79925fa
|
PCB: swap U2,U2, version 1.7.2
Footprint ESP-32 a little bit moved
|
7 years ago |
|
Emard
|
ebc6e501fe
|
PCB: update SDRAM new pitch
|
7 years ago |
|
Emard
|
775c304aee
|
PCB: swap U4,U5, move via a bit away from switcher pad
|
7 years ago |
|
Emard
|
df1930e887
|
PCB: swap L2 <-> L3
|
7 years ago |
|
Emard
|
2d56b3ba29
|
PCB v1.7.1 increased SDRAM pitch 0.8 -> 0.8077 mm
|
7 years ago |
|
Emard
|
7dd439cae6
|
PCB: use SOA008 footprint for SPI flash chip
|
7 years ago |
|
Emard
|
d363ae009d
|
PCB: update with I2C footprint
|
7 years ago |
|
Emard
|
eee33da15b
|
PCB: RTC footprint updated
|
7 years ago |
|
Emard
|
36fed52378
|
PCB: Reoriented SD card slot placed
|
7 years ago |
|
Emard
|
27d45661c9
|
PCB: SD card proper insertion orientation
|
7 years ago |
|
Emard
|
1364d53520
|
PCB: audio jack update
|
7 years ago |
|
Emard
|
cdf9e06d06
|
PCB: I2C SM8 package used with proper 3D orientation
|
7 years ago |
|
Emard
|
d0802747ac
|
PCB: NXP RTC footprint changed to SOT96-1 properly oriented
|
7 years ago |
|
Emard
|
ebfbe5a298
|
PCB: re-run DRC
|
7 years ago |
|
Emard
|
9b3494741b
|
PCB: some parts were not enabled for insertion
(Normal+Insert) must be checked to appear on centroid list
|
7 years ago |
|
Emard
|
483906c052
|
PCB: change according to schematics 1.2V->1.1V
|
7 years ago |
|
Emard
|
f3c834cf54
|
PCB: SD card slot part name and esp-32 3D shape
|
7 years ago |
|
davor
|
9692fea61d
|
cosmetix: LED D22 moved a bit left to be symmetrical
|
7 years ago |
|
Emard
|
1c498602ad
|
silkscreen "+-" markings
|
7 years ago |
|
Emard
|
ef5f8c5100
|
Labels on J1/J2 connectors
|
7 years ago |
|
Emard
|
66459da5c7
|
WIFI VSPI connected on PCB
|
7 years ago |
|
Emard
|
c8084d5419
|
updating LED symbols on PCB
trac cosmetix
|
7 years ago |
|
Emard
|
c75a671e06
|
WIFI LED on PCB
|
7 years ago |
|
Emard
|
b0a41af38f
|
trac cosmetix
|
7 years ago |
|
Emard
|
fea181ae72
|
CEC resistor on PCB
|
7 years ago |
|
Emard
|
ca9fcf4df4
|
connecting missing SD card pins on PCB
|
7 years ago |
|
Emard
|
68299246cf
|
trac cosmetix
|
7 years ago |
|
Emard
|
da5b2c9c59
|
trac cosmetiscs: optimizing +5V to closest point
thickening 3.3V and GND on 2.54 mm header
|
7 years ago |
|
Emard
|
d68058d1ae
|
PCB properly set true-complenet A9-B10
|
7 years ago |
|
Emard
|
cae3c0a488
|
trac cosmetix
|
7 years ago |
|
Emard
|
35b3a8b3dd
|
changing to 45F which is production device now
schem symbol 45F fixed typo T8->T7 (GND) and SERDES
|
7 years ago |
|
davor
|
050a70079a
|
move one audio-v pin from bank0 to bank7 so
now all audio jack pins are on bank7
|
7 years ago |
|
davor
|
5769ed05ae
|
trac cosmetix
|
7 years ago |
|
davor
|
f5688676a5
|
trac cosmetix
|
7 years ago |
|
davor
|
0d71e508ae
|
analog: audio ring2 resistor DAC network connected to FPGA
copper infill is getting thin, so minimal-thickness traces
are used 0.127 mm
|
7 years ago |
|
davor
|
f843d3169a
|
gpdi sheet, i2c voltage shifter, VREF filtering with C18 100nF->470nF
|
7 years ago |
|
davor
|
6d74bb29fc
|
PCB v1.7 fix wrong audio jack connection
|
7 years ago |
|
Emard
|
9672d92e12
|
small trace/via thickening and cosmetic edits
|
7 years ago |
|
Emard
|
ea7fc52d1e
|
small track cosmetics
|
7 years ago |
|
Emard
|
ba4c8e8d22
|
PCB v1.6 SDRAM fully reworked
|
7 years ago |
|
Emard
|
eca6978391
|
HDMI fixed wrong wiring PCB v1.5
and improving copper fill areas
|
7 years ago |
|
davor
|
1a37921f27
|
moving J1 silkscreen mark away from solering area
|
7 years ago |
|
davor
|
330e7bc0fc
|
removing silkscreen square and writing around 433 pad
|
7 years ago |
|
davor
|
af531b0fd5
|
LED values renamed to RED and GREEN
|
7 years ago |
|
davor
|
9d8be27731
|
logo "HRVATSKI PROIZVOD" enlarged and moved towards audio connector
|
7 years ago |
|
davor
|
bc41b3052d
|
move WIFI disable jumper closer to BTN1
|
7 years ago |
|
davor
|
ee87635b6d
|
moving copper infill area to expose 433 antenna
|
7 years ago |
|
Emard
|
d57b16519c
|
update (I hope) all chip units to 85F
add more GND vias
|
7 years ago |
|
davor
|
fffde2cf88
|
Additional GND for 85F chips
|
7 years ago |
|
Emard
|
07de158d38
|
R56 for FT231X rev A,B,C workaround from TN140_FT231X Errata
|
8 years ago |
|
Emard
|
ed1d52ada8
|
BAT1 reference moved near CR1225
|
8 years ago |
|
Emard
|
1773cd14fa
|
iproving differential routing (purple layer)
|
8 years ago |
|
Emard
|
06a8d751d9
|
Jumpers (default OFF) for 3 switcher voltages
|
8 years ago |
|
davor
|
1cdad1e4d0
|
all diodes SOD-323 and SOD-323F packages changed to handsoldering
(bigger pads, more reworkable)
silkscreen moving references GPDI1 and SW1 for readability
|
8 years ago |
|
davor
|
77b35c7bd2
|
battery, remove silkscreen printing from the pad
and other small silkscreen updates
|
8 years ago |
|
Emard
|
b6f388d228
|
ESP-32S footprint changed to avoid
silkscreen writing over the pads,
small cosmetics around
|
8 years ago |
|
Emard
|
a7a1424ef2
|
Silkscren: RIZ logo removed (Marko requested),
Written Battery clip name and battery type,
Cleaned up some markings mess
|
8 years ago |
|
Emard
|
cf8da0d984
|
Logos EMARD, RADIONA, RIZ, FER, HRVATSKI PROIZVOD
Gerbers update
|
8 years ago |
|
Emard
|
a913ffb675
|
Micro SD outline moved to correct layer (b.mask->f.fab)
|
8 years ago |
|
Emard
|
ae1aee7f5e
|
Micro SD contacts were OK for SCHD3A100.
Readme update.
Silkscreen outline drawn.
|
8 years ago |
|
davor
|
bc4b88ee58
|
Micro SD: using SCHD3A0100
|
8 years ago |
|
davor
|
c42c90ae37
|
FPGA_DONE connected to ESP32 over a resistors,
Other resistors moved away to allow routing thru the mess.
ESP-32 connected missing GND pin
|
8 years ago |
|
davor
|
f3d84dbfdc
|
LED D19 was oriented wrong, now correct
|
8 years ago |
|
davor
|
10df092413
|
using modified ECP5 footprint
|
8 years ago |
|
Emard
|
bcc8afbf16
|
unclutter values on Fab layers
|
8 years ago |
|
Emard
|
f8b5dc97eb
|
update SD card power supply and gerbers
|
8 years ago |
|
Emard
|
ca7dcfa0ca
|
sligtly detach R54 in 3D view (move up Z axis)
to indicate it should not be placed by default
|
8 years ago |
|
Emard
|
bab7ee607e
|
placeholder for 1.5k pullup for usb 1.0
|
8 years ago |
|
Emard
|
9cc436ce8c
|
Additional VCC 2.2uF blocking capacitors near the switching
power supply to form PI-filter with another 2.2uF near BGA
|
8 years ago |
|
Emard
|
2be19bd4a3
|
aligning capacitors under BGA (cosmetics and visual effects)
|
8 years ago |
|
davor
|
2963509427
|
text labes with voltages 1.2V, 2.5V, 3.3V near capacitors under BGA
|
8 years ago |
|
davor
|
7e2a91f295
|
VCC blocker capacitors 2.2uF sprinkled under BGA
|
8 years ago |
|
davor
|
62165f1ddb
|
BGA silkscreen and minor traces adjustment
|
8 years ago |
|
davor
|
f99179bc88
|
gerbers update
|
8 years ago |
|
davor
|
d957c8521b
|
3D models of resistors 0603
|
8 years ago |
|
Emard
|
091baa515a
|
gerbers update
|
8 years ago |
|
Emard
|
91ac1cc478
|
D8,D9,D51,D52: SMA package 2A low drop low profile
|
8 years ago |
|
davor
|
68a23c127c
|
set package SOD323 to all small diodes
|
8 years ago |
|
davor
|
aef23559d2
|
3D models for capacitors inductors transistors and some resistors
|
8 years ago |
|
davor
|
f32ace3adf
|
D15 schottky diode BAT54W package SOD323F
|
8 years ago |
|
davor
|
4347a2b7bf
|
JTAG, FTDI and serial LEDs moved left, away from buttons
|
8 years ago |
|
Emard
|
d0cf4eaeaf
|
DIP switch correct footprint
|
8 years ago |
|
Emard
|
9cdf0c04ed
|
USB move 0.635 mm up
|
8 years ago |
|
Emard
|
d463d17f18
|
32768Hz crystal ABS25 footprint now correct
|
8 years ago |
|
Emard
|
bcf94bafab
|
buttons footprints correct now
|
8 years ago |
|
Emard
|
e3080fafa6
|
moving text (references) out of pads
|
8 years ago |
|
Emard
|
cc4c1dd6ee
|
aligning BTN's and DIP SW
|
8 years ago |
|
Emard
|
6c38aabb74
|
moving "UP" button 1.27 mm up
3D models for dipswitch
|
8 years ago |
|
davor
|
eaf4c2402a
|
Fab layer, moving values to avoid overlap writings
GPDI footprint edited to remove some unneeded lines
Gerbers update
|
8 years ago |
|
davor
|
d7d473396a
|
Moving C1 reference away from 2.54 mm header solder pads
|
8 years ago |
|
davor
|
201cb628b1
|
removing transistor SOT-23 3D models (wrong orientation)
moving some capacitor reference for readability
|
8 years ago |
|
davor
|
52047f93d8
|
moving 5V IN/OUT routing diode to bottom side
|
8 years ago |
|
davor
|
fba16cd43e
|
Silkscreen JTAG tidying up
|
8 years ago |
|
davor
|
8c0f769536
|
Silkscreen writings FPGA, 32MB, ULX3S v1.0, ADC, RTC, 25 MHz
|
8 years ago |
|
davor
|
52fc46899e
|
silkscreen on bottom layer: avoiding writing on solder pads
|
8 years ago |
|
davor
|
53ea44f214
|
Silkscreen JTAG header signal names
readme update
|
8 years ago |
|
davor
|
5a2eb8220f
|
silkscreen on top layer: avoiding writing on solder pads
|
8 years ago |
|
Emard
|
407177a486
|
Move HDMI a bit closer to OLED
|
8 years ago |
|
Emard
|
e15ab7d84f
|
removing battery circle from the sikscreen
(changing footprint)
|
8 years ago |
|
Emard
|
e3a535e842
|
move 25MHz clock generator Y1 away from heat and EM noise
|
8 years ago |
|
Emard
|
7569433437
|
removing OLED outline from the silkscreen
(footprint changed)
|
8 years ago |
|
Emard
|
0312d80fa3
|
reducing default solder mask clearance to 0.05 mm
it will help preventing shortcuts coming from solder
overflow
|
8 years ago |
|
Emard
|
64f70e4998
|
routing 5V using shorter path between 2 USB connectors
|
8 years ago |
|
davor
|
f120d212d9
|
433 MHz onboard antenna (need to uncover copper infill layers)
|
8 years ago |
|
Emard
|
46218e383e
|
yellow layer cleanup - removing part of trace leading nowhere
|
8 years ago |
|
Emard
|
e76db02634
|
small changes, moving the traces
|
8 years ago |
|
davor
|
9f6eae914c
|
connecting almost all free pins from ESP32 to FPGA
(only 4 left unconnected)
|
8 years ago |
|
Emard
|
1f9c416f60
|
R25 moved away from OLED screw hole (to the bottom side)
|
8 years ago |
|
Emard
|
1588776a9d
|
top layer GND infill
|
8 years ago |
|
Emard
|
7768508f33
|
moving battery to allow clearance from VBAT pad and screw hole (GND)
|
8 years ago |
|
davor
|
68db94dacd
|
small cleanup of traces/vias
|
8 years ago |
|
davor
|
d462ffc350
|
Connecting more ESP32 WIFI pins,
sharing them with external 2.54 mm header
to access ADC and HSPI
|
8 years ago |
|
davor
|
600c4478fd
|
esp32: avoid connection to NC pin for JTAG_TDO
|
8 years ago |
|
davor
|
0229a768ad
|
FPGA direct-to-pin Hackish USB transciver 27 ohm + 3.6 V zener
|
8 years ago |
|
davor
|
00c73747b3
|
thicker USB GND traces, vias and small cleanup on nearby traces
|
8 years ago |
|
davor
|
1ab504aaf2
|
Moving USB connectors on top layer
|
8 years ago |
|
davor
|
fdf38ad9a1
|
DIP switch moved to the right, near RAM.
Maybe should be moved more to the right not to overlap with OLED
|
8 years ago |
|
davor
|
fbe0cf4d01
|
symmetric usb left-right
|
8 years ago |
|
davor
|
45827eecf5
|
moving silkscreen values and references out of BGA pads
|
8 years ago |
|
Emard
|
4d3828764b
|
tidying up routes
|
8 years ago |
|
davor
|
5f589c33f4
|
USB directly to FPGA for possible USB1.1 core
|
8 years ago |
|
davor
|
236f63488a
|
DIP SWITCH routed
|
8 years ago |
|
davor
|
6d14ed8ff0
|
Placing DIP switch, but not yet connecting it to FPGA
|
8 years ago |
|
davor
|
37bb008e24
|
ADC connecting REF+/REF- and SPI
|
8 years ago |
|
davor
|
2ca8acc32d
|
ADC chip moved on top layer.
Connecting 8 analog lines to J2
and remaining VCC/GND
|
8 years ago |
|
davor
|
32836831ae
|
i2c of RTC connected to GPDI i2c
|
8 years ago |
|
davor
|
ee20b46f6d
|
connecting ADC substrate pad to GND
|
8 years ago |
|
davor
|
a0d3693b66
|
moving ADC chip near J2, better possibility to get routed
|
8 years ago |
|
davor
|
851f2a0162
|
optimizing PCB lines for +5V
|
8 years ago |
|
davor
|
2153a220a0
|
schematic symbol for ADC MAX11123
small PCB traces cleanup
ADC chip placed on PCB but connected only to GND
|
8 years ago |
|
Emard
|
be09416928
|
Add 27 ohm resistors in series with FTDI USB and readme update
|
8 years ago |
|
davor
|
278ac6b341
|
2.2uF for ESP-32 and gerber update
|
8 years ago |
|
davor
|
81b3ea5da0
|
adding minimal set of 3 2.2uF capacitor for 1.2V, 2.5V and 3.3V
|
8 years ago |
|
davor
|
96fabee1bc
|
Moving C18 away from battery
|
8 years ago |
|
Emard
|
a11072b4e4
|
beautifying routes of LEDs and moving oscillator under the LEDs
|
8 years ago |
|
Emard
|
ee7d266543
|
Resistors for LEDs
|
8 years ago |
|
Emard
|
18aef04f2c
|
JTAG header
|
8 years ago |
