davor
|
68a23c127c
|
set package SOD323 to all small diodes
|
7 years ago |
|
davor
|
aef23559d2
|
3D models for capacitors inductors transistors and some resistors
|
7 years ago |
|
davor
|
f32ace3adf
|
D15 schottky diode BAT54W package SOD323F
|
7 years ago |
|
davor
|
4347a2b7bf
|
JTAG, FTDI and serial LEDs moved left, away from buttons
|
7 years ago |
|
Emard
|
d0cf4eaeaf
|
DIP switch correct footprint
|
7 years ago |
|
Emard
|
9cdf0c04ed
|
USB move 0.635 mm up
|
7 years ago |
|
Emard
|
d463d17f18
|
32768Hz crystal ABS25 footprint now correct
|
7 years ago |
|
Emard
|
bcf94bafab
|
buttons footprints correct now
|
7 years ago |
|
Emard
|
e3080fafa6
|
moving text (references) out of pads
|
7 years ago |
|
Emard
|
cc4c1dd6ee
|
aligning BTN's and DIP SW
|
7 years ago |
|
Emard
|
6c38aabb74
|
moving "UP" button 1.27 mm up
3D models for dipswitch
|
7 years ago |
|
davor
|
eaf4c2402a
|
Fab layer, moving values to avoid overlap writings
GPDI footprint edited to remove some unneeded lines
Gerbers update
|
7 years ago |
|
davor
|
201cb628b1
|
removing transistor SOT-23 3D models (wrong orientation)
moving some capacitor reference for readability
|
7 years ago |
|
davor
|
52047f93d8
|
moving 5V IN/OUT routing diode to bottom side
|
7 years ago |
|
davor
|
fba16cd43e
|
Silkscreen JTAG tidying up
|
7 years ago |
|
davor
|
8c0f769536
|
Silkscreen writings FPGA, 32MB, ULX3S v1.0, ADC, RTC, 25 MHz
|
7 years ago |
|
davor
|
52fc46899e
|
silkscreen on bottom layer: avoiding writing on solder pads
|
7 years ago |
|
davor
|
53ea44f214
|
Silkscreen JTAG header signal names
readme update
|
7 years ago |
|
davor
|
5a2eb8220f
|
silkscreen on top layer: avoiding writing on solder pads
|
7 years ago |
|
Emard
|
407177a486
|
Move HDMI a bit closer to OLED
|
7 years ago |
|
Emard
|
e15ab7d84f
|
removing battery circle from the sikscreen
(changing footprint)
|
7 years ago |
|
Emard
|
e3a535e842
|
move 25MHz clock generator Y1 away from heat and EM noise
|
7 years ago |
|
Emard
|
7569433437
|
removing OLED outline from the silkscreen
(footprint changed)
|
7 years ago |
|
Emard
|
0312d80fa3
|
reducing default solder mask clearance to 0.05 mm
it will help preventing shortcuts coming from solder
overflow
|
7 years ago |
|
Emard
|
64f70e4998
|
routing 5V using shorter path between 2 USB connectors
|
7 years ago |
|
davor
|
f120d212d9
|
433 MHz onboard antenna (need to uncover copper infill layers)
|
7 years ago |
|
Emard
|
46218e383e
|
yellow layer cleanup - removing part of trace leading nowhere
|
7 years ago |
|
Emard
|
e76db02634
|
small changes, moving the traces
|
7 years ago |
|
davor
|
9f6eae914c
|
connecting almost all free pins from ESP32 to FPGA
(only 4 left unconnected)
|
7 years ago |
|
Emard
|
1588776a9d
|
top layer GND infill
|
7 years ago |
|
Emard
|
7768508f33
|
moving battery to allow clearance from VBAT pad and screw hole (GND)
|
7 years ago |
|
davor
|
68db94dacd
|
small cleanup of traces/vias
|
7 years ago |
|
davor
|
d462ffc350
|
Connecting more ESP32 WIFI pins,
sharing them with external 2.54 mm header
to access ADC and HSPI
|
7 years ago |
|
davor
|
600c4478fd
|
esp32: avoid connection to NC pin for JTAG_TDO
|
7 years ago |
|
davor
|
0229a768ad
|
FPGA direct-to-pin Hackish USB transciver 27 ohm + 3.6 V zener
|
7 years ago |
|
davor
|
00c73747b3
|
thicker USB GND traces, vias and small cleanup on nearby traces
|
7 years ago |
|
davor
|
1ab504aaf2
|
Moving USB connectors on top layer
|
7 years ago |
|
davor
|
fdf38ad9a1
|
DIP switch moved to the right, near RAM.
Maybe should be moved more to the right not to overlap with OLED
|
7 years ago |
|
davor
|
fbe0cf4d01
|
symmetric usb left-right
|
7 years ago |
|
davor
|
45827eecf5
|
moving silkscreen values and references out of BGA pads
|
7 years ago |
|
Emard
|
4d3828764b
|
tidying up routes
|
7 years ago |
|
davor
|
5f589c33f4
|
USB directly to FPGA for possible USB1.1 core
|
8 years ago |
|
davor
|
236f63488a
|
DIP SWITCH routed
|
8 years ago |
|
davor
|
6d14ed8ff0
|
Placing DIP switch, but not yet connecting it to FPGA
|
8 years ago |
|
davor
|
37bb008e24
|
ADC connecting REF+/REF- and SPI
|
8 years ago |
|
davor
|
2ca8acc32d
|
ADC chip moved on top layer.
Connecting 8 analog lines to J2
and remaining VCC/GND
|
8 years ago |
|
davor
|
32836831ae
|
i2c of RTC connected to GPDI i2c
|
8 years ago |
|
davor
|
ee20b46f6d
|
connecting ADC substrate pad to GND
|
8 years ago |
|
davor
|
a0d3693b66
|
moving ADC chip near J2, better possibility to get routed
|
8 years ago |
|
davor
|
851f2a0162
|
optimizing PCB lines for +5V
|
8 years ago |
