|  Emard | bfde293d5d | PCB: make version on printed sheet same as on the silkscreen | 7 years ago | 
				
					
						|  Emard | 458b3302da | PCB v3.0.7: attempt to fix tombstoning of R65 | 7 years ago | 
				
					
						|  Emard | e8139f268e | PCB: attempt to fix tombstoning of R2, RA2, RA3, R33. R56 not yet fixed. | 7 years ago | 
				
					
						|  emard | 0f1e4cc6f8 | PCB: trac cosmetix at RA3 | 7 years ago | 
				
					
						|  emard | 85e1b0266a | PCB v3.0.6 | 7 years ago | 
				
					
						|  emard | 0cb9bf1847 | PCB: improve thermal management at RB3 | 7 years ago | 
				
					
						|  emard | 13b0239789 | PCB: trac cosmetix | 7 years ago | 
				
					
						|  emard | 09bdc2ca4b | PCB: R56 made invisible on 3D view (file renamed to *.wrl_disabled) updated ft231x outline on the silkscreen | 7 years ago | 
				
					
						|  emard | d1ba33c0eb | PCB: increase paste to copper pad clearance for larger pads | 7 years ago | 
				
					
						|  emard | b48f23c7a6 | PCB: trac cosmetix at 5V yellow trace near D12 and C54 | 7 years ago | 
				
					
						|  emard | 81cdae7eeb | PCB: assembly floorplan update (remove U11,R56,D28 add RV3) | 7 years ago | 
				
					
						|  emard | 252710e987 | PCB v3.0.5: connect FTDI_nRXLED to FPGA | 7 years ago | 
				
					
						|  davor | 59695884a5 | PCB: trac cosmetix near SW1 pin4 connecting copper fill islandKX | 7 years ago | 
				
					
						|  Emard | 562605053a | PCB v3.0.4: thermal management at RV2 RV3 | 7 years ago | 
				
					
						|  Emard | d9c67c017c | PCB: paste removed from GPDI1 thru-holes | 7 years ago | 
				
					
						|  Emard | 717a2e9e0d | PCB: v3.0.3 (version font un-mirrored) | 7 years ago | 
				
					
						|  Emard | 011b077d10 | PCB v3.0.2: trac cosmetix, version moved to bottom side | 7 years ago | 
				
					
						|  Emard | 8596bf4272 | PCB: thermal management and trac cosmetix | 7 years ago | 
				
					
						|  Emard | 44687617c7 | PCB: improve copper fill island connectivity under GPDI1 | 7 years ago | 
				
					
						|  Emard | ffe841d2e3 | PCB: solder paste to pad clearance increased -0.025 -> -0.05 applied to everything except BGA | 7 years ago | 
				
					
						|  Emard | d015a448cc | PCB v3.0.1: trac cosmetix around C8 | 7 years ago | 
				
					
						|  Emard | 4fae315dfd | PCB: thermal management around C7 | 7 years ago | 
				
					
						|  Emard | b7104fe958 | PCB: trac cosmetix around D28 and US2 | 7 years ago | 
				
					
						|  Emard | e75c839775 | PCB: more GND to C7 | 7 years ago | 
				
					
						|  Emard | 5da5aef9b5 | PCB: thermal management around C1 | 7 years ago | 
				
					
						|  Emard | ea8e02c2fe | PCB: trac cosmetix remove redundand trace towards GPDI1 THT hole | 7 years ago | 
				
					
						|  Emard | 222a3182f6 | PCB: trac cosmetix under US1 vias | 7 years ago | 
				
					
						|  Emard | c89d277b32 | PCB: v3.0: (only version bump v2.1.17->v3.0) | 7 years ago | 
				
					
						|  Emard | 2f284399db | PCB v2.1.17: Silkscreen cosmetix text "SDRAM" moved away from pads
text "R56" moved from top to bottom side, where it belongs | 7 years ago | 
				
					
						|  Emard | d2506bad02 | PCB v2.1.16: SDRAM pads length 1.1->1.2 mm | 7 years ago | 
				
					
						|  Emard | 65512e8323 | PCB v2.1.15: rounded pads for PCB jumpers, BGA thermal management | 7 years ago | 
				
					
						|  Emard | aaa8f530d1 | PCB v2.1.14: thermal management and trac cosmetix | 7 years ago | 
				
					
						|  Emard | 247db8b329 | PCB v2.1.12: thermal management (Zec suggestions) | 7 years ago | 
				
					
						|  Emard | 5680223e2d | PCB v2.1.11: thermal management | 7 years ago | 
				
					
						|  Emard | 65320e230f | PCB: thermal management around RV2 RV3 | 7 years ago | 
				
					
						|  Emard | 7305ea83ba | PCB: silkscreen cosmetix R11 R12 | 7 years ago | 
				
					
						|  Emard | a68c9789de | PCB v2.1.10: thernal management against tombstoning | 7 years ago | 
				
					
						|  Emard | e4addde457 | PCB v2.1.9: move VIAs out of pads under BGA update R56 as virtual to not appear in fabrication placement list
copper fill keepout on jumpers
trac cosmetix | 7 years ago | 
				
					
						|  Emard | 9099c7f928 | PCB: ADC silkscreen dot update | 7 years ago | 
				
					
						|  Emard | df8154be45 | PCB v2.1.8: BGA chip alignment fiducials, ft231x reduced row distance | 7 years ago | 
				
					
						|  Emard | 3eabc3d722 | PCB: ft231x enlarged silkscreen outline | 7 years ago | 
				
					
						|  Emard | 3f4842a718 | PCB: balancing thermal relief on both SMD pads of R,C in attempt to prevent tombstoning | 7 years ago | 
				
					
						|  Emard | f9e4c8f0e3 | PCB v2.1.7: new footprints for R,C and LED with rounded pads | 7 years ago | 
				
					
						|  Emard | dfcd39ecf4 | PCB v2.1.6: trac cosmetix around SDRAM | 7 years ago | 
				
					
						|  Emard | 2f6f450ce3 | PCB: updated SDRAM footprint and trac cosmetix | 7 years ago | 
				
					
						|  Emard | 59c3943ce9 | PCB: adc silkscreen cosmetix | 7 years ago | 
				
					
						|  Emard | c7e9196ce2 | PCB: updating dipswitch and adc silkscreen | 7 years ago | 
				
					
						|  Emard | 9848db7076 | PCB: update footprints for ADC and USBSERIAL grid origin to lower left edge of PCB | 7 years ago | 
				
					
						|  Emard | 90f43a53b8 | PCB: trac cosmetix | 7 years ago | 
				
					
						|  Emard | 91a831541e | PCB v2.1.5: ADC land pattern pads distance now 4.68 mm | 7 years ago |