Emard
|
b7fd68a25f
|
PCB: more GND VIAs
|
6 years ago |
Emard
|
6e2b08c1e3
|
PCB: solder paste to copper clearance -0.025 mm from each edge
|
6 years ago |
Emard
|
1f7c73ee9c
|
PCB: trac cosmetix
|
6 years ago |
Emard
|
ea9638730e
|
PCB: trac cosmetix
|
6 years ago |
Emard
|
e43e4c3452
|
PCB: trac cosmetix
|
6 years ago |
Emard
|
3d1d25b4f8
|
PCB: trac cosmetix
|
6 years ago |
Emard
|
2af23a8cfc
|
PCB: trac cosmetix
|
6 years ago |
Emard
|
4bd061b9f5
|
PCB v2.0.10: trac & via cosmetix
|
6 years ago |
Emard
|
797d383599
|
PCB: trac cosmetix
|
6 years ago |
Emard
|
807be26e47
|
PCB: trac cosmetix
|
6 years ago |
Emard
|
28caee6000
|
PCB: trac cosmetix
|
6 years ago |
Emard
|
acb0a3d0ab
|
PCB: trac cosmetix
|
6 years ago |
Emard
|
6a0c0ab47f
|
PCB: silkscreen block for handwritten notes
|
6 years ago |
Emard
|
3021028ff5
|
PCB: trac cosmetix, routing BTN_R around to allow more BGA GND VIAs
|
6 years ago |
Emard
|
6d07a69129
|
PCB: trac cosmetix
|
6 years ago |
Emard
|
893f23e27c
|
PCB: add more VIAs under BGA
|
6 years ago |
Emard
|
854f71bdda
|
PCB: FPGA again set as visible in 3D view
|
6 years ago |
Emard
|
676837ef3d
|
PCB v2.0.9: trac/via cosmetix
|
6 years ago |
Emard
|
91b435bdfa
|
PCB v2.0.8: removing fill GND top layer under BGA, trac cosmetix
|
6 years ago |
Emard
|
ca91d6bb34
|
PCB: reducing copper traces on top layer under BGA to 0.127 mm
|
6 years ago |
Emard
|
26ea73e434
|
PCB: trac cosmetix
|
6 years ago |
Emard
|
3aa8344fe6
|
PCB v2.0.7
|
6 years ago |
Emard
|
6c4868a752
|
PCB: thicker under SD card 0.127 -> 0.19 mm
|
6 years ago |
Emard
|
f18467c4a7
|
PCB: thicker USB_FPGA 0.127 -> 0.19 mm
|
6 years ago |
Emard
|
89a8f56097
|
PCB: thicker GPN0-27 0.127 -> 0.19 mm
|
6 years ago |
Emard
|
d6ccd6d60c
|
PCB: thicker to LEDs 0.127 -> 0.19 mm
|
6 years ago |
Emard
|
2709e5df41
|
PCB: thicker traces (0.5 mm) to 2.54 mm connectors J1, J2, SDRAM 0.127 -> 0.19 mm
|
6 years ago |
Emard
|
f3cd6335a2
|
PCB: enlarging BGA vias to 0.419 mm, DRC passed, need trac cosmetix
|
6 years ago |
Emard
|
c98ea8dcdc
|
PCB: net class enlarged VIA diameter 0.4 -> 0.419 mm
|
6 years ago |
Emard
|
8d85bf2d47
|
PCB: thinner BGA traces 0.19 -> 0.127 mm (5 mil), DRC passed
|
6 years ago |
Emard
|
c942bf5a60
|
PCB: aligning VIAs under BGA to 0.4 mm raster
|
6 years ago |
Emard
|
ac500e7ca9
|
BGA pads increased to 0.4mm but VIAs remain the same
|
6 years ago |
Emard
|
8dd4311d72
|
PCB: reduced clearance 0.127->0.1 mm to accept BGA slightly larger pads
|
6 years ago |
Emard
|
0131ac8882
|
PCB: C60 (B0 debouncer) smaller footprint 0805->0603, trac cosmetix
|
7 years ago |
Emard
|
a5a4b267e7
|
PCB v2.0.6: debouncing capacitor for B0
|
7 years ago |
Emard
|
3eb0c4ba4e
|
PCB v2.0.5 trac cosmetix, spacing D28 D29
|
7 years ago |
Emard
|
881944c549
|
trac cosmetix
|
7 years ago |
Emard
|
7af9d25b7a
|
PCB re-run DRC
|
7 years ago |
Emard
|
69bca8f25f
|
PCB v2.0.4 signal USER_PROGRAMN
|
7 years ago |
Emard
|
0ab1e05a5b
|
PCB: silkscreen near D28 text: "B0PRG"
|
7 years ago |
Emard
|
eb64bc3168
|
PCB: cosmetix around D28 and R31
|
7 years ago |
Emard
|
777e124823
|
PCB v2.0.3: diode D28 for BTN0 to PROGRAMN
|
7 years ago |
Emard
|
4f807d82ab
|
PCB v2.0.2: trac cosmetix
|
7 years ago |
Emard
|
2072c42771
|
PCB v2.0.1
|
7 years ago |
Emard
|
504897b697
|
PCB: trac cosmetix
|
7 years ago |
Emard
|
2ffbd07ad1
|
PCB: remove stray paste blob from GPDI1 connector
|
7 years ago |
Emard
|
60f1c32619
|
PCB: remove solder paste from ESP32 pads
|
7 years ago |
Emard
|
a0d1a468bd
|
PCB: trac cosmetix, moving parts away from J1,J2 connectors
|
7 years ago |
Emard
|
50621b4572
|
PCB: move grid origin (white target) to cender of drill and place origin (red target)
|
7 years ago |
davor
|
cf5a1fdfd9
|
PCB: reload project with kicad5 rc3
|
7 years ago |