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# SMT Component Removal HOWTO
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## Items needed
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* PCB with components
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* PCB cradle
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* ZT-1 Airbath
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* ZT-3 Airpick
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* Anti-static brush
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* No clean flux
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* De-solder wire
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* 2x foam swabs
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* Solder vacuum
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* Non-flammable flux remover
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## Procedure
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1. Secure the PCB in the cradle above the ZT-1 airbath.
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1. Use an anti-static brush and the no clean flux to apply the flux onto the contact leads of the component.
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1. Turn on the airbath to warm. It will slowly heat up to 150 C.
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1. Take a strand of de-solder wire and melt it directly onto the leads of the component. Can be liberal and use as much as needed to cover all the leads.
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1. After a couple seconds, the de-solder will fully melt onto the leads.
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1. Pick up the ZT-3 Airpick. Place a finger over the hole to create a vacuum.
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1. Use the airpick to pick up the component. Release your finger to drop the component.
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1. Use a foam swab and the no clean flux. Gently use the swab to push the de-solder blobs into one bubble.
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1. Use a vacuum to suck up the bubble of de-solder.
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1. Use the foam swab and no clean flux to apply a light coat of flux to the area.
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1. Switch the airbath to cool.
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1. Use a foam swab and the non-flammable flux remover to apply the remover to area. It is recommended to apply a second coat.
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1. Turn off the airbath and remove the PCB.
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# Solder Pot HOWTO
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## Items needed
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* Solder pot
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* Lead-free solder, cut into small enough pieces to fit in the solder pot.
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* Dross Skimmer
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* Tweezers
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* Component(s)
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## Procedure
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1. Turn on the solder pot to its highest temp.
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1. (First time) Add a piece of lead-free solder.
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1. After initial use, the pot will melt the current solder in it from last use.
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1. As the first piece melts, add additional pieces of lead free solder until the melted level is near the top of the solder pot.
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1. Use the skimmer to remove the top layer of residue from the melted solder.
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1. Using tweezer, dip your component leads into the solder. The only the leads should be put into the solder, avoid contact with component itself.
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1. Repeat 4 and 5 for all components.
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1. Turn the solder pot off. The remaining solder will solidify and will be melted again in future use.
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# Through Hole Component Removal HOWTO
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## Items needed
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* PCB with component(s) to be removed
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* PCB cradle
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* No clean flux
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* 2 cotton swabs
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* Soldering Iron
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* De-solder wire
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* Solder vacuum
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* Tweezers
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* Flux remover
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1. Secure the PCB into the cradle.
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1. Swab the area with no clean flux.
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1. Heat the soldering iron up to the melting temperature of the solder on the board. For lead-free solder, this around 420 C.
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1. Using a soldering iron, melt some de-solder wire onto the leads to be soldered.
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1. Press the soldering iron against the lead. The de-solder and solder should melt into a bubble.
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1. Use a solder vacuum immediately after removing the soldering iron away from the lead.
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1. Repeat 4-5 until enough solder has been removed so that the lead can freely move. If this is not the case, add step 3 as well.
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1. Repeat 4-5 for every lead.
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1. The component should be able to be removed with tweezers. Turn off the soldering iron.
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1. Use a cotton swab and flux remover to clean the area.
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