convert HOWTOs from ODT to Markdown

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Jeff Moe 4 years ago
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# SMT Component Removal HOWTO
## Items needed
* PCB with components
* PCB cradle
* ZT-1 Airbath
* ZT-3 Airpick
* Anti-static brush
* No clean flux
* De-solder wire
* 2x foam swabs
* Solder vacuum
* Non-flammable flux remover
## Procedure
1. Secure the PCB in the cradle above the ZT-1 airbath.
1. Use an anti-static brush and the no clean flux to apply the flux onto the contact leads of the component.
1. Turn on the airbath to warm. It will slowly heat up to 150 C.
1. Take a strand of de-solder wire and melt it directly onto the leads of the component. Can be liberal and use as much as needed to cover all the leads.
1. After a couple seconds, the de-solder will fully melt onto the leads.
1. Pick up the ZT-3 Airpick. Place a finger over the hole to create a vacuum.
1. Use the airpick to pick up the component. Release your finger to drop the component.
1. Use a foam swab and the no clean flux. Gently use the swab to push the de-solder blobs into one bubble.
1. Use a vacuum to suck up the bubble of de-solder.
1. Use the foam swab and no clean flux to apply a light coat of flux to the area.
1. Switch the airbath to cool.
1. Use a foam swab and the non-flammable flux remover to apply the remover to area. It is recommended to apply a second coat.
1. Turn off the airbath and remove the PCB.

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# Solder Pot HOWTO
## Items needed
* Solder pot
* Lead-free solder, cut into small enough pieces to fit in the solder pot.
* Dross Skimmer
* Tweezers
* Component(s)
## Procedure
1. Turn on the solder pot to its highest temp.
1. (First time) Add a piece of lead-free solder.
1. After initial use, the pot will melt the current solder in it from last use.
1. As the first piece melts, add additional pieces of lead free solder until the melted level is near the top of the solder pot.
1. Use the skimmer to remove the top layer of residue from the melted solder.
1. Using tweezer, dip your component leads into the solder. The only the leads should be put into the solder, avoid contact with component itself.
1. Repeat 4 and 5 for all components.
1. Turn the solder pot off. The remaining solder will solidify and will be melted again in future use.

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# Through Hole Component Removal HOWTO
## Items needed
* PCB with component(s) to be removed
* PCB cradle
* No clean flux
* 2 cotton swabs
* Soldering Iron
* De-solder wire
* Solder vacuum
* Tweezers
* Flux remover
1. Secure the PCB into the cradle.
1. Swab the area with no clean flux.
1. Heat the soldering iron up to the melting temperature of the solder on the board. For lead-free solder, this around 420 C.
1. Using a soldering iron, melt some de-solder wire onto the leads to be soldered.
1. Press the soldering iron against the lead. The de-solder and solder should melt into a bubble.
1. Use a solder vacuum immediately after removing the soldering iron away from the lead.
1. Repeat 4-5 until enough solder has been removed so that the lead can freely move. If this is not the case, add step 3 as well.
1. Repeat 4-5 for every lead.
1. The component should be able to be removed with tweezers. Turn off the soldering iron.
1. Use a cotton swab and flux remover to clean the area.

@ -206,8 +206,8 @@ HOWTO Solder BGA components.
## Rework through hole components
HOWTO Rework through hole components.
* [Through Hole Component Removal]
(through-hole-component-removal.odt)
* [Through Hole Component Removal HOWTO]
(HOWTO/through-hole-component-removal-HOWTO.md)
## Rework SMT components
HOWTO Rework SMT components.
@ -215,7 +215,7 @@ HOWTO Rework SMT components.
Current Practice:
* [SMT Component Removal HOWTO]
(HOWTO/smt-component-removal.odt)
(HOWTO/smt-component-removal-HOWTO.md)
## Rework BGA components
HOWTO Rework BGA components.
@ -240,8 +240,8 @@ HOWTO Apply solder paste with electronic syringe.
## Solder Pot
HOWTO Use a solder pot.
* [Solder Pot Usage]
(HOWTO/solder-pot-use.odt)
* [Solder Pot HOWTO]
(HOWTO/solder-pot-HOWTO.md)
# PCBA Testing
Pins.

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