laser notes

HOWTO/laser-solder-paste-stencil-inkscape.md

@@ -31,8 +31,24 @@ This process is for one or two layer boards. You could make
 stencils for more layers, but that is only useful if you have a
 process to assemble PCBs with more than two layers.
 
+
+J-Tech Photonics has some documentation about this process using
+an ancient printer, Replicator G software (!),
+and proprietary PCB software. See here:
+
+
+https://jtechphotonics.com/?p=473
+
+
+Note, from that blog post:
+
+* "We will then need to shrink the pads and holes by about 2 mills to allow for the spot size of the laser beam on the stencil material when processing."
+This step is not being done below. XXX
+
+
 ## KiCAD Steps
 
+
 Do thusly:
 
 * Open your KiCAD `.pro` file.
@@ -141,7 +157,7 @@ In the task bar set `X:` to `0.000` and `Y:` to `0.000`.
 
 * `Travel Speed (mm/min or in/min)`: `1000`. XXX confirm.
 
-* `Laser Speed (mm/min or in/min)`: `500`. XXX confirm speed for transparencies.
+* `Laser Speed (mm/min or in/min)`: `600`. XXX confirm speed for transparencies.
 
 * `Laser Power S# (0-255 or 0-12000)`: `255`.
 
@@ -225,13 +241,14 @@ Position the transparency in landscape mode, unless portrait mode is needed.
 Bottom left of transparency should be in front left corner on
 printer.
 
-* Secure the transparency/paper sandwich to the aluminium plate and bed
-with three large paperclips.
+* Secure the transparency/paper sandwich to the aluminium plate and bed.
+Use three large paper clips and/or tape.
 
 * Slowly move toolhead to position where you want the bottom
 left corner of the stencil to begin (e.g. X=0, Y=0 of the stencil). It is
 probably best to have a margin of 50mm around the edges (XXX number). 
-Make sure the LASER will be past the clips holding the transparency in place.
+Make sure the LASER will be past the paper clips and tape
+holding the transparency in place.
 
 * Power on printer.