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TrellisBoard
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Part Name: TrellisBoard
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Company: Fork Sand, Inc.
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Contact: Jeff Moe <moe@forksand.com>
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Fork Sand, Inc. fork/clone.
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Files:
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- gerber/: gerbers for all layers
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F_Cu, In1_Cu..In6_Cu, B_Cu: copper layers from top to bottom (8 layers)
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F_SilkS, B_SilkS: top and bottom silkscreen
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F_Mask, B_Mask: top and bottom soldermask
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F_Paste, B_Paste: top and bottom stencil
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Edge_Cuts: board outline
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NPTH: non-plated holes drill
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PTH: plated holes drill
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- part_mapping_top.svg, part_mapping_bottom.svg: graphical part mapping (copy of silkscreen)
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- ecp5_mainboard-all-pos.csv: x & y coordinates for all SMD parts
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- ecp5_mainboard_bom_advancedcircuits.ods: bill-of-materials for all parts in LibreOffice format
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- ecp5_mainboard_bom_advancedcircuits-export.xls: bill-of-materials for all parts exported to XLS format
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BOM notes:
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- Turnkey order, all parts to be ordered by Advanced Circuits.
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- Parts with "Substition Allowed" = N must be exact part number match from a distributor (DigiKey, Mouser, etc). DigiKey part numbers are typically given but other distributors may be used
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- Parts with "Substition Allowed" = Y may be substitued with parts of an equal or better specification from another manufacturer/distributor.
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PCB specification:
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- 200mm x 111.14mm (7.87" x 4.38").
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- 8 layers.
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- FR4 material.
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- 1.6mm board thickness.
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- 1oz copper thickness.
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- 3mil track/3mil space.
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- 0.2mm minimum hole diameter.
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- ENIG surface finish.
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- No gold fingers.
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- 30 degree bevelling for card edge connector. "15 mils bevel depth with 45 degree angle" OK alternate.
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- 3,367 holes.
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- Do not clean SW1, MPN: CHP-081TA.
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- Do not place J8,J14.
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- Green soldermask.
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- White silkscreen.
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- RoHS: Yes.
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