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readme update

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pull/3/head
Emard 6 years ago
parent 04d0c95036
commit 01c84700b8
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README.md
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@ -287,7 +287,7 @@ Here is checklist what was done or should be done in the next PCB release.
[x] USB: copper fill keepout [x] USB: copper fill keepout
[x] ADC: footprint according to MAX1112x land pattern 90-0023 [x] ADC: footprint according to MAX1112x land pattern 90-0023
[ ] fix tombstoning see https://www.tempoautomation.com/blog/surface-mount-tombstone-experiment/ [ ] fix tombstoning see https://www.tempoautomation.com/blog/surface-mount-tombstone-experiment/
[ ] Avoid VIAs on the PADs [x] Avoid VIAs on the PADs
[x] aligment marks for BGA footprint using exposed gold plated copper [x] aligment marks for BGA footprint using exposed gold plated copper
[ ] Order ADCs in reel (not bulk, not tube). [ ] Order ADCs in reel (not bulk, not tube).
[x] check increased distance of 2 pad rows of SDRAM [x] check increased distance of 2 pad rows of SDRAM

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