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footprints: max1112x pads distance reduced to 4.68 mm according to land pattern 90-0023

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pull/3/head
Emard 6 years ago
parent f2c2ff7c82
commit 131bd8391e
1 changed files with 29 additions and 29 deletions
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58
footprints/adc/max1112x-tqfn28.pretty/MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm.kicad_mod
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@ -1,4 +1,4 @@
(module max1112x-tqfn28:MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm (layer F.Cu) (tedit 5B8FE9AB) (module max1112x-tqfn28:MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm (layer F.Cu) (tedit 5B925511)
(descr "28-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN or VQFN]; (see Microchip Packaging Specification 00000049BS.pdf)") (descr "28-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN or VQFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "TQFN 0.5") (tags "TQFN 0.5")
(attr smd) (attr smd)
@ -29,34 +29,34 @@
) )
(fp_circle (center -2.3 -3.1496) (end -2.2 -3.1496) (layer F.SilkS) (width 0.15)) (fp_circle (center -2.3 -3.1496) (end -2.2 -3.1496) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 -2.625) (end -2.9 -2.9) (layer F.SilkS) (width 0.15)) (fp_line (start -2.625 -2.625) (end -2.9 -2.9) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.45 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 1 smd rect (at -2.34 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.45 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 2 smd rect (at -2.34 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.45 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 3 smd rect (at -2.34 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.45 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 4 smd rect (at -2.34 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.45 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 5 smd rect (at -2.34 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.45 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 6 smd rect (at -2.34 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -2.45 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 7 smd rect (at -2.34 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -1.5 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 8 smd rect (at -1.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at -1 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 9 smd rect (at -1 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -0.5 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 10 smd rect (at -0.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 0 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 11 smd rect (at 0 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 0.5 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 12 smd rect (at 0.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 1 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 13 smd rect (at 1 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 1.5 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 14 smd rect (at 1.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at 2.45 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 15 smd rect (at 2.34 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.45 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 16 smd rect (at 2.34 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 2.45 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 17 smd rect (at 2.34 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at 2.45 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 18 smd rect (at 2.34 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at 2.45 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 19 smd rect (at 2.34 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at 2.45 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 20 smd rect (at 2.34 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at 2.45 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 21 smd rect (at 2.34 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 22 smd rect (at 1.5 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 22 smd rect (at 1.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 23 smd rect (at 1 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 23 smd rect (at 1 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 24 smd rect (at 0.5 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 24 smd rect (at 0.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 25 smd rect (at 0 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 25 smd rect (at 0 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 26 smd rect (at -0.5 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 26 smd rect (at -0.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 27 smd rect (at -1 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 27 smd rect (at -1 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 28 smd rect (at -1.5 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 28 smd rect (at -1.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 29 smd rect (at 0.8125 0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask) (pad 29 smd rect (at 0.8125 0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2)) (solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at 0.8125 -0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask) (pad 29 smd rect (at 0.8125 -0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)

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