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BGA layout updated with refernce to lattice document

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TN1074: PCB Layout Recommendations for BGA Packages
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Emard 6 years ago
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commit 321f82dc86
1 changed files with 6 additions and 2 deletions
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doc/bga-layout.txt
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for proper placing ground and power planes, see for proper placing ground and power planes, see
TN1074 - PCB Layout Recommendations for BGA Packages, page 32 TN1074 - PCB Layout Recommendations for BGA Packages
example for BGA 381 ECP5 page 1: table 1: row 0.8 ball pitch, 756/554/381/400 caBGA
Pad copper diameter: 0.4 mm
Solder mask opening: 0.5 mm
Solder land diameter: 0.35 mm (solder paste = stencil opening)
page 32: example for BGA 381 ECP5

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