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@ -243,4 +243,5 @@ Here is checklist what was done or should be done in the next PCB release.
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[x] fix copper layer after using non-handsoldering resistor footprints
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[x] fix copper layer after using non-handsoldering resistor footprints
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[x] DIP switch must be pulled up at 2.5/3.3V or 2.5V line, not 3.3V
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[x] DIP switch must be pulled up at 2.5/3.3V or 2.5V line, not 3.3V
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[x] RTC time loss at power down fixed with 1k+22uF - see page 54 of datasheet
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[x] RTC time loss at power down fixed with 1k+22uF - see page 54 of datasheet
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[ ] Rotate SD card 180° for easier front loading
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