readme update

pull/3/head
davor 7 years ago
parent 9f2c23cabb
commit 36afed97e6

@ -243,4 +243,5 @@ Here is checklist what was done or should be done in the next PCB release.
[x] fix copper layer after using non-handsoldering resistor footprints [x] fix copper layer after using non-handsoldering resistor footprints
[x] DIP switch must be pulled up at 2.5/3.3V or 2.5V line, not 3.3V [x] DIP switch must be pulled up at 2.5/3.3V or 2.5V line, not 3.3V
[x] RTC time loss at power down fixed with 1k+22uF - see page 54 of datasheet [x] RTC time loss at power down fixed with 1k+22uF - see page 54 of datasheet
[ ] Rotate SD card 180° for easier front loading

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