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PCB: ft231x enlarged silkscreen outline

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pull/3/head
Emard 6 years ago
parent b8251359ae
commit 3eabc3d722
2 changed files with 177 additions and 177 deletions
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174
ulx3s.kicad_pcb
Unescape View File

@ -664,6 +664,85 @@
(add_net 2V5_3V3)
)
(module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 5B9966E3) (tstamp 5B2637EB)
(at 132.835 107.14 180)
(descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)")
(tags "FT231X SSOP 0.65")
(path /58D6BF46/58EB61C6)
(attr smd)
(fp_text reference U6 (at -3.556 4.318 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value FT231XS (at -0.045 -4.86 180) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start 2.286 -4.064) (end 2.286 -3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -4.064) (end 2.286 -4.064) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -3.429) (end -2.286 -4.064) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 3.429) (end -3.302 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 4.064) (end -2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -0.508 4.064) (end -2.286 4.064) (layer B.SilkS) (width 0.15))
(fp_line (start 2.286 4.064) (end 2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start 0.508 4.064) (end 2.286 4.064) (layer B.SilkS) (width 0.15))
(fp_arc (start 0 4.064) (end -0.508 4.064) (angle 180) (layer B.SilkS) (width 0.15))
(fp_line (start -3.65 -3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end 3.65 3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start 3.65 3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end -3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.2 2.25) (end -1.2 3.25) (layer B.Fab) (width 0.15))
(fp_line (start -2.2 -3.25) (end -2.2 2.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 -3.25) (end -2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 3.25) (end 2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start -1.2 3.25) (end 2.2 3.25) (layer B.Fab) (width 0.15))
(fp_text user %R (at 0 0 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(pad 20 smd oval (at 2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 94 FTDI_TXD))
(pad 19 smd oval (at 2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 122 FTDI_nSLEEP))
(pad 18 smd oval (at 2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 160 FTDI_TXDEN))
(pad 17 smd oval (at 2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask))
(pad 16 smd oval (at 2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 15 smd oval (at 2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 38 USB5V))
(pad 14 smd oval (at 2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 40 nRESET))
(pad 13 smd oval (at 2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 173 FT2V5))
(pad 12 smd oval (at 2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 100 USB_FTDI_D-))
(pad 11 smd oval (at 2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 99 USB_FTDI_D+))
(pad 10 smd oval (at -2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 121 FTDI_nTXLED))
(pad 9 smd oval (at -2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 21 JTAG_TDO))
(pad 8 smd oval (at -2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 20 JTAG_TMS))
(pad 7 smd oval (at -2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 19 JTAG_TCK))
(pad 6 smd oval (at -2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 5 smd oval (at -2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 18 JTAG_TDI))
(pad 4 smd oval (at -2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 95 FTDI_RXD))
(pad 3 smd oval (at -2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 173 FT2V5))
(pad 2 smd oval (at -2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 93 FTDI_nRTS))
(pad 1 smd rect (at -2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 41 FTDI_nDTR))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Capacitor_SMD:C_0603_1608Metric (layer F.Cu) (tedit 5B301BBE) (tstamp 5AF6F50B)
(at 151.758 75.771 90)
(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
@ -6345,85 +6424,6 @@
)
)
(module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 5B937925) (tstamp 5B2637EB)
(at 132.835 107.14 180)
(descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)")
(tags "FT231X SSOP 0.65")
(path /58D6BF46/58EB61C6)
(attr smd)
(fp_text reference U6 (at -3.556 4.318 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value FT231XS (at -0.045 -4.86 180) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start 2.286 -3.81) (end 2.286 -3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -3.81) (end 2.286 -3.81) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -3.429) (end -2.286 -3.81) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 3.429) (end -3.302 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 3.81) (end -2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -0.508 3.81) (end -2.286 3.81) (layer B.SilkS) (width 0.15))
(fp_line (start 2.286 3.81) (end 2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start 0.508 3.81) (end 2.286 3.81) (layer B.SilkS) (width 0.15))
(fp_arc (start 0 3.81) (end -0.508 3.81) (angle 180) (layer B.SilkS) (width 0.15))
(fp_line (start -3.65 -3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end 3.65 3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start 3.65 3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end -3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.2 2.25) (end -1.2 3.25) (layer B.Fab) (width 0.15))
(fp_line (start -2.2 -3.25) (end -2.2 2.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 -3.25) (end -2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 3.25) (end 2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start -1.2 3.25) (end 2.2 3.25) (layer B.Fab) (width 0.15))
(fp_text user %R (at 0 0 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(pad 20 smd oval (at 2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 94 FTDI_TXD))
(pad 19 smd oval (at 2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 122 FTDI_nSLEEP))
(pad 18 smd oval (at 2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 160 FTDI_TXDEN))
(pad 17 smd oval (at 2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask))
(pad 16 smd oval (at 2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 15 smd oval (at 2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 38 USB5V))
(pad 14 smd oval (at 2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 40 nRESET))
(pad 13 smd oval (at 2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 173 FT2V5))
(pad 12 smd oval (at 2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 100 USB_FTDI_D-))
(pad 11 smd oval (at 2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 99 USB_FTDI_D+))
(pad 10 smd oval (at -2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 121 FTDI_nTXLED))
(pad 9 smd oval (at -2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 21 JTAG_TDO))
(pad 8 smd oval (at -2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 20 JTAG_TMS))
(pad 7 smd oval (at -2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 19 JTAG_TCK))
(pad 6 smd oval (at -2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 5 smd oval (at -2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 18 JTAG_TDI))
(pad 4 smd oval (at -2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 95 FTDI_RXD))
(pad 3 smd oval (at -2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 173 FT2V5))
(pad 2 smd oval (at -2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 93 FTDI_nRTS))
(pad 1 smd rect (at -2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 41 FTDI_nDTR))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module usb_otg:USB-MICRO-B-FCI-10118192-0001LF (layer F.Cu) (tedit 5B1AC2A8) (tstamp 5B24ABD3)
(at 111.88 63.325 180)
(path /58D6BF46/58D6C840)
@ -16627,7 +16627,7 @@
(segment (start 138.08 97.88801) (end 138.114991 97.923001) (width 0.127) (layer In1.Cu) (net 271))
(segment (start 133.68 89.4) (end 136.340188 92.060188) (width 0.127) (layer In1.Cu) (net 271))
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B994501) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B996B9A) (hatch edge 0.508)
(connect_pads (clearance 0.254))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -18574,7 +18574,7 @@
)
)
)
(zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B9944FE) (hatch edge 0.508)
(zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B996B97) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -18641,7 +18641,7 @@
)
)
)
(zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B9944FB) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B996B94) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.126)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20078,7 +20078,7 @@
)
)
)
(zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B9944F8) (hatch edge 0.508)
(zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B996B91) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.126)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20338,7 +20338,7 @@
)
)
)
(zone (net 169) (net_name +1V1) (layer In1.Cu) (tstamp 5B9944F5) (hatch edge 0.508)
(zone (net 169) (net_name +1V1) (layer In1.Cu) (tstamp 5B996B8E) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20428,7 +20428,7 @@
)
)
)
(zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B9944F2) (hatch edge 0.508)
(zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B996B8B) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.127)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20585,7 +20585,7 @@
)
)
)
(zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B9944EF) (hatch edge 0.508)
(zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B996B88) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.126)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -22025,7 +22025,7 @@
)
)
)
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B9944EC) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B996B85) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))

180
ulx3s.kicad_pcb-bak
Unescape View File

@ -11,9 +11,9 @@
(page A4)
(layers
(0 F.Cu signal hide)
(1 In1.Cu signal hide)
(2 In2.Cu signal hide)
(0 F.Cu signal)
(1 In1.Cu signal)
(2 In2.Cu signal)
(31 B.Cu signal)
(32 B.Adhes user)
(33 F.Adhes user)
@ -664,6 +664,85 @@
(add_net 2V5_3V3)
)
(module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 5B9965A8) (tstamp 5B2637EB)
(at 132.835 107.14 180)
(descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)")
(tags "FT231X SSOP 0.65")
(path /58D6BF46/58EB61C6)
(attr smd)
(fp_text reference U6 (at -3.556 4.318 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value FT231XS (at -0.045 -4.86 180) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start 2.286 -4.318) (end 2.286 -3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -4.318) (end 2.286 -4.318) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -3.429) (end -2.286 -4.318) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 3.429) (end -3.302 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 4.318) (end -2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -0.508 4.318) (end -2.286 4.318) (layer B.SilkS) (width 0.15))
(fp_line (start 2.286 4.318) (end 2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start 0.508 4.318) (end 2.286 4.318) (layer B.SilkS) (width 0.15))
(fp_arc (start 0 4.318) (end -0.508 4.318) (angle 180) (layer B.SilkS) (width 0.15))
(fp_line (start -3.65 -3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end 3.65 3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start 3.65 3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end -3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.2 2.25) (end -1.2 3.25) (layer B.Fab) (width 0.15))
(fp_line (start -2.2 -3.25) (end -2.2 2.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 -3.25) (end -2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 3.25) (end 2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start -1.2 3.25) (end 2.2 3.25) (layer B.Fab) (width 0.15))
(fp_text user %R (at 0 0 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(pad 20 smd oval (at 2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 94 FTDI_TXD))
(pad 19 smd oval (at 2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 122 FTDI_nSLEEP))
(pad 18 smd oval (at 2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 160 FTDI_TXDEN))
(pad 17 smd oval (at 2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask))
(pad 16 smd oval (at 2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 15 smd oval (at 2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 38 USB5V))
(pad 14 smd oval (at 2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 40 nRESET))
(pad 13 smd oval (at 2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 173 FT2V5))
(pad 12 smd oval (at 2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 100 USB_FTDI_D-))
(pad 11 smd oval (at 2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 99 USB_FTDI_D+))
(pad 10 smd oval (at -2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 121 FTDI_nTXLED))
(pad 9 smd oval (at -2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 21 JTAG_TDO))
(pad 8 smd oval (at -2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 20 JTAG_TMS))
(pad 7 smd oval (at -2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 19 JTAG_TCK))
(pad 6 smd oval (at -2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 5 smd oval (at -2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 18 JTAG_TDI))
(pad 4 smd oval (at -2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 95 FTDI_RXD))
(pad 3 smd oval (at -2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 173 FT2V5))
(pad 2 smd oval (at -2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 93 FTDI_nRTS))
(pad 1 smd rect (at -2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 41 FTDI_nDTR))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Capacitor_SMD:C_0603_1608Metric (layer F.Cu) (tedit 5B301BBE) (tstamp 5AF6F50B)
(at 151.758 75.771 90)
(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
@ -6345,85 +6424,6 @@
)
)
(module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 5B937925) (tstamp 5B2637EB)
(at 132.835 107.14 180)
(descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)")
(tags "FT231X SSOP 0.65")
(path /58D6BF46/58EB61C6)
(attr smd)
(fp_text reference U6 (at -3.556 4.318 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value FT231XS (at -0.045 -4.86 180) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start 2.286 -3.81) (end 2.286 -3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -3.81) (end 2.286 -3.81) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -3.429) (end -2.286 -3.81) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 3.429) (end -3.302 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 3.81) (end -2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -0.508 3.81) (end -2.286 3.81) (layer B.SilkS) (width 0.15))
(fp_line (start 2.286 3.81) (end 2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start 0.508 3.81) (end 2.286 3.81) (layer B.SilkS) (width 0.15))
(fp_arc (start 0 3.81) (end -0.508 3.81) (angle 180) (layer B.SilkS) (width 0.15))
(fp_line (start -3.65 -3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end 3.65 3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start 3.65 3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end -3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.2 2.25) (end -1.2 3.25) (layer B.Fab) (width 0.15))
(fp_line (start -2.2 -3.25) (end -2.2 2.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 -3.25) (end -2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 3.25) (end 2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start -1.2 3.25) (end 2.2 3.25) (layer B.Fab) (width 0.15))
(fp_text user %R (at 0 0 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(pad 20 smd oval (at 2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 94 FTDI_TXD))
(pad 19 smd oval (at 2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 122 FTDI_nSLEEP))
(pad 18 smd oval (at 2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 160 FTDI_TXDEN))
(pad 17 smd oval (at 2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask))
(pad 16 smd oval (at 2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 15 smd oval (at 2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 38 USB5V))
(pad 14 smd oval (at 2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 40 nRESET))
(pad 13 smd oval (at 2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 173 FT2V5))
(pad 12 smd oval (at 2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 100 USB_FTDI_D-))
(pad 11 smd oval (at 2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 99 USB_FTDI_D+))
(pad 10 smd oval (at -2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 121 FTDI_nTXLED))
(pad 9 smd oval (at -2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 21 JTAG_TDO))
(pad 8 smd oval (at -2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 20 JTAG_TMS))
(pad 7 smd oval (at -2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 19 JTAG_TCK))
(pad 6 smd oval (at -2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 5 smd oval (at -2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 18 JTAG_TDI))
(pad 4 smd oval (at -2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 95 FTDI_RXD))
(pad 3 smd oval (at -2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 173 FT2V5))
(pad 2 smd oval (at -2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 93 FTDI_nRTS))
(pad 1 smd rect (at -2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 41 FTDI_nDTR))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module usb_otg:USB-MICRO-B-FCI-10118192-0001LF (layer F.Cu) (tedit 5B1AC2A8) (tstamp 5B24ABD3)
(at 111.88 63.325 180)
(path /58D6BF46/58D6C840)
@ -16627,7 +16627,7 @@
(segment (start 138.08 97.88801) (end 138.114991 97.923001) (width 0.127) (layer In1.Cu) (net 271))
(segment (start 133.68 89.4) (end 136.340188 92.060188) (width 0.127) (layer In1.Cu) (net 271))
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5BA19499) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B996B9A) (hatch edge 0.508)
(connect_pads (clearance 0.254))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -18574,7 +18574,7 @@
)
)
)
(zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5BA19496) (hatch edge 0.508)
(zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B996B97) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -18641,7 +18641,7 @@
)
)
)
(zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5BA19493) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B996B94) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.126)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20078,7 +20078,7 @@
)
)
)
(zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5BA19490) (hatch edge 0.508)
(zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B996B91) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.126)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20338,7 +20338,7 @@
)
)
)
(zone (net 169) (net_name +1V1) (layer In1.Cu) (tstamp 5BA1948D) (hatch edge 0.508)
(zone (net 169) (net_name +1V1) (layer In1.Cu) (tstamp 5B996B8E) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20428,7 +20428,7 @@
)
)
)
(zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5BA1948A) (hatch edge 0.508)
(zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B996B8B) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.127)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20585,7 +20585,7 @@
)
)
)
(zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5BA19487) (hatch edge 0.508)
(zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B996B88) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.126)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -22025,7 +22025,7 @@
)
)
)
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5BA19484) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B996B85) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))

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