footprints: Solder paste for GPDI1 THT holes only on the SMD pad side (Front side)

pull/3/head
davor 6 years ago
parent 3917f845ae
commit 844444ca57

@ -1,4 +1,4 @@
(module conn-fci:CONN-10029449-111RLF (layer F.Cu) (tedit 5B3F4594) (module conn-fci:CONN-10029449-111RLF (layer F.Cu) (tedit 5B3F6261)
(attr smd) (attr smd)
(fp_text reference GPDI1 (at 0 -3.1115) (layer F.SilkS) (fp_text reference GPDI1 (at 0 -3.1115) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15))) (effects (font (size 1 1) (thickness 0.15)))
@ -13,10 +13,10 @@
(fp_line (start 9.1 -2.2) (end 9.1 7.5) (layer F.CrtYd) (width 0.35)) (fp_line (start 9.1 -2.2) (end 9.1 7.5) (layer F.CrtYd) (width 0.35))
(fp_line (start -9.1 -2.2) (end 9.1 -2.2) (layer F.CrtYd) (width 0.35)) (fp_line (start -9.1 -2.2) (end 9.1 -2.2) (layer F.CrtYd) (width 0.35))
(fp_line (start -9.1 7.5) (end -9.1 -2.2) (layer F.CrtYd) (width 0.35)) (fp_line (start -9.1 7.5) (end -9.1 -2.2) (layer F.CrtYd) (width 0.35))
(pad 0 thru_hole circle (at 7.85 4.9) (size 2 2) (drill 1.3) (layers *.Cu *.Paste *.Mask)) (pad 0 thru_hole circle (at 7.85 4.9) (size 2 2) (drill 1.3) (layers *.Cu *.Mask F.Paste))
(pad 0 thru_hole circle (at -7.85 4.9) (size 2 2) (drill 1.3) (layers *.Cu *.Paste *.Mask)) (pad 0 thru_hole circle (at -7.85 4.9) (size 2 2) (drill 1.3) (layers *.Cu *.Mask F.Paste))
(pad 0 thru_hole circle (at 7.25 0) (size 2 2) (drill 1.3) (layers *.Cu *.Paste *.Mask)) (pad 0 thru_hole circle (at 7.25 0) (size 2 2) (drill 1.3) (layers *.Cu *.Mask F.Paste))
(pad 0 thru_hole circle (at -7.25 0) (size 2 2) (drill 1.3) (layers *.Cu *.Paste *.Mask)) (pad 0 thru_hole circle (at -7.25 0) (size 2 2) (drill 1.3) (layers *.Cu *.Mask F.Paste))
(pad 1 smd rect (at 4.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask)) (pad 1 smd rect (at 4.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at 4.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask)) (pad 2 smd rect (at 4.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at 3.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask)) (pad 3 smd rect (at 3.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))

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