footprints: oval pads for ADC and USBSERIAL, only pad 1 squared

usbserial pads enlarged by 0.1mm towards the chip
pull/3/head
Emard 6 years ago
parent 49db26aeea
commit 94357f52b7

@ -1,4 +1,4 @@
(module max1112x-tqfn28:MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm (layer F.Cu) (tedit 5B925511) (module max1112x-tqfn28:MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm (layer F.Cu) (tedit 5B937794)
(descr "28-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN or VQFN]; (see Microchip Packaging Specification 00000049BS.pdf)") (descr "28-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN or VQFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "TQFN 0.5") (tags "TQFN 0.5")
(attr smd) (attr smd)
@ -30,33 +30,33 @@
(fp_circle (center -2.3 -3.1496) (end -2.2 -3.1496) (layer F.SilkS) (width 0.15)) (fp_circle (center -2.3 -3.1496) (end -2.2 -3.1496) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 -2.625) (end -2.9 -2.9) (layer F.SilkS) (width 0.15)) (fp_line (start -2.625 -2.625) (end -2.9 -2.9) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.34 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 1 smd rect (at -2.34 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.34 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 2 smd oval (at -2.34 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.34 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 3 smd oval (at -2.34 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.34 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 4 smd oval (at -2.34 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.34 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 5 smd oval (at -2.34 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.34 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 6 smd oval (at -2.34 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -2.34 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 7 smd oval (at -2.34 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -1.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 8 smd oval (at -1.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at -1 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 9 smd oval (at -1 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -0.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 10 smd oval (at -0.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 0 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 11 smd oval (at 0 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 0.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 12 smd oval (at 0.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 1 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 13 smd oval (at 1 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 1.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 14 smd oval (at 1.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at 2.34 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 15 smd oval (at 2.34 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.34 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 16 smd oval (at 2.34 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 2.34 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 17 smd oval (at 2.34 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at 2.34 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 18 smd oval (at 2.34 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at 2.34 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 19 smd oval (at 2.34 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at 2.34 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 20 smd oval (at 2.34 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at 2.34 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 21 smd oval (at 2.34 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 22 smd rect (at 1.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 22 smd oval (at 1.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 23 smd rect (at 1 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 23 smd oval (at 1 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 24 smd rect (at 0.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 24 smd oval (at 0.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 25 smd rect (at 0 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 25 smd oval (at 0 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 26 smd rect (at -0.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 26 smd oval (at -0.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 27 smd rect (at -1 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 27 smd oval (at -1 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 28 smd rect (at -1.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 28 smd oval (at -1.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 29 smd rect (at 0.8125 0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask) (pad 29 smd rect (at 0.8125 0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2)) (solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at 0.8125 -0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask) (pad 29 smd rect (at 0.8125 -0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)

@ -1,11 +1,11 @@
(module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer F.Cu) (tedit 5B852359) (module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer F.Cu) (tedit 5B937E1E)
(descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)") (descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)")
(tags "FT231X SSOP 0.65") (tags "FT231X SSOP 0.65")
(attr smd) (attr smd)
(fp_text reference U6 (at -3.556 -4.318) (layer F.SilkS) (fp_text reference U6 (at -3.556 -4.318) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15))) (effects (font (size 1 1) (thickness 0.15)))
) )
(fp_text value FT231XS (at -0.045 4.86) (layer F.Fab) (fp_text value FT231XS (at -0.045 4.86) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15))) (effects (font (size 1 1) (thickness 0.15)))
) )
(fp_text user %R (at 0 0) (layer F.Fab) (fp_text user %R (at 0 0) (layer F.Fab)
@ -29,26 +29,26 @@
(fp_line (start -2.286 3.429) (end -2.286 3.81) (layer F.SilkS) (width 0.15)) (fp_line (start -2.286 3.429) (end -2.286 3.81) (layer F.SilkS) (width 0.15))
(fp_line (start -2.286 3.81) (end 2.286 3.81) (layer F.SilkS) (width 0.15)) (fp_line (start -2.286 3.81) (end 2.286 3.81) (layer F.SilkS) (width 0.15))
(fp_line (start 2.286 3.81) (end 2.286 3.429) (layer F.SilkS) (width 0.15)) (fp_line (start 2.286 3.81) (end 2.286 3.429) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.9 -2.925) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 1 smd rect (at -2.85 -2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.9 -2.275) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 2 smd oval (at -2.85 -2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.9 -1.625) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 3 smd oval (at -2.85 -1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.9 -0.975) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 4 smd oval (at -2.85 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.9 -0.325) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 5 smd oval (at -2.85 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.9 0.325) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 6 smd oval (at -2.85 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -2.9 0.975) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 7 smd oval (at -2.85 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -2.9 1.625) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 8 smd oval (at -2.85 1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at -2.9 2.275) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 9 smd oval (at -2.85 2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -2.9 2.925) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 10 smd oval (at -2.85 2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 2.9 2.925) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 11 smd oval (at 2.85 2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 2.9 2.275) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 12 smd oval (at 2.85 2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 2.9 1.625) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 13 smd oval (at 2.85 1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 2.9 0.975) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 14 smd oval (at 2.85 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at 2.9 0.325) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 15 smd oval (at 2.85 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.9 -0.325) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 16 smd oval (at 2.85 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 2.9 -0.975) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 17 smd oval (at 2.85 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at 2.9 -1.625) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 18 smd oval (at 2.85 -1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at 2.9 -2.275) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 19 smd oval (at 2.85 -2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at 2.9 -2.925) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) (pad 20 smd oval (at 2.85 -2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl
(at (xyz 0 0 0)) (at (xyz 0 0 0))
(scale (xyz 1 1 1)) (scale (xyz 1 1 1))

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