footprints: BGA rename fiducial pads 0->X (as 0 is usually gnd)

footprints/lattice/lfe5bg381.pretty/BGA-381_pitch0.8mm_dia0.4mm.kicad_mod

@@ -1,4 +1,4 @@
-(module lfe5bg381:BGA-381_pitch0.8mm_dia0.4mm (layer F.Cu) (tedit 5B9A54FE)
+(module lfe5bg381:BGA-381_pitch0.8mm_dia0.4mm (layer F.Cu) (tedit 5B9D222C)
   (attr smd)
   (fp_text reference U1 (at -8.2 -9.8) (layer F.SilkS)
     (effects (font (size 1 1) (thickness 0.15)))
@@ -31,12 +31,12 @@
   (fp_line (start 8.1 8.6) (end -8.1 8.6) (layer F.SilkS) (width 0.15))
   (fp_line (start 8.6 -8.1) (end 8.6 8.1) (layer F.SilkS) (width 0.15))
   (fp_line (start -8.6 -8.6) (end 8.1 -8.6) (layer F.SilkS) (width 0.15))
-  (pad 0 smd oval (at 8.5 8.5) (size 0.127 0.508) (layers F.Cu F.Mask))
+  (pad X smd oval (at 8.5 8.5) (size 0.127 0.508) (layers F.Cu F.Mask))
-  (pad 0 smd oval (at 8.5 8.5) (size 0.508 0.127) (layers F.Cu F.Mask))
+  (pad X smd oval (at 8.5 8.5) (size 0.508 0.127) (layers F.Cu F.Mask))
-  (pad 0 smd oval (at -8.5 8.5) (size 0.508 0.127) (layers F.Cu F.Mask))
+  (pad X smd oval (at -8.5 8.5) (size 0.508 0.127) (layers F.Cu F.Mask))
-  (pad 0 smd oval (at -8.5 8.5) (size 0.127 0.508) (layers F.Cu F.Mask))
+  (pad X smd oval (at -8.5 8.5) (size 0.127 0.508) (layers F.Cu F.Mask))
-  (pad 0 smd oval (at 8.5 -8.5) (size 0.508 0.127) (layers F.Cu F.Mask))
+  (pad X smd oval (at 8.5 -8.5) (size 0.508 0.127) (layers F.Cu F.Mask))
-  (pad 0 smd oval (at 8.5 -8.5) (size 0.127 0.508) (layers F.Cu F.Mask))
+  (pad X smd oval (at 8.5 -8.5) (size 0.127 0.508) (layers F.Cu F.Mask))
   (pad A2 smd circle (at -6.8 -7.6) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)
     (solder_mask_margin 0.05) (solder_paste_margin -0.025))
   (pad A3 smd circle (at -6 -7.6) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)