readme update

pull/3/head
Emard 6 years ago
parent 93f6aa5836
commit f65f243c92

@ -287,4 +287,8 @@ Here is checklist what was done or should be done in the next PCB release.
[x] USB: copper fill keepout [x] USB: copper fill keepout
[x] ADC: footprint according to MAX1112x land pattern 90-0023 [x] ADC: footprint according to MAX1112x land pattern 90-0023
[ ] fix tombstoning see https://www.tempoautomation.com/blog/surface-mount-tombstone-experiment/ [ ] fix tombstoning see https://www.tempoautomation.com/blog/surface-mount-tombstone-experiment/
[ ] Avoid VIAs on the PADs
[ ] aligment marks for BGA footprint using exposed gold plated copper
[ ] Order ADCs in reel (not bulk, not tube).
[ ] check increased distance of 2 pad rows for SDRAM
[ ] check increased distance of 2 pad rows for FT231X

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