Emard
|
e4addde457
|
PCB v2.1.9: move VIAs out of pads under BGA
update R56 as virtual to not appear in fabrication placement list
copper fill keepout on jumpers
trac cosmetix
|
6 years ago |
|
Emard
|
b92a15489b
|
footprints: BGA rename fiducial pads 0->X (as 0 is usually gnd)
|
6 years ago |
|
Emard
|
9099c7f928
|
PCB: ADC silkscreen dot update
|
6 years ago |
|
Emard
|
c322f6029d
|
footprints: ADC moving dot to better visible location (pin-1 marker)
|
6 years ago |
|
Emard
|
a45244fd95
|
gerbers v2.1.8
|
6 years ago |
|
Emard
|
9b841adea0
|
readme update
|
6 years ago |
|
Emard
|
df8154be45
|
PCB v2.1.8: BGA chip alignment fiducials, ft231x reduced row distance
|
6 years ago |
|
Emard
|
18379d51a8
|
footprints: BGA with fiducial pads for chip alignment
|
6 years ago |
|
Emard
|
47a0e3576a
|
footprints: ft231x reduce distance of 2 rows to 5.4 mm
|
6 years ago |
|
Emard
|
f65f243c92
|
readme update
|
6 years ago |
|
Emard
|
93f6aa5836
|
box: centering 3-led view slit
|
6 years ago |
|
Emard
|
3eabc3d722
|
PCB: ft231x enlarged silkscreen outline
|
6 years ago |
|
Emard
|
b8251359ae
|
footprints: ft231x enlarged silkscreen outline
|
6 years ago |
|
Emard
|
3f374a7860
|
gerbers update
|
6 years ago |
|
Emard
|
3f4842a718
|
PCB: balancing thermal relief on both SMD pads of R,C in attempt to prevent tombstoning
|
6 years ago |
|
Emard
|
861d10f7ad
|
gerbers v2.1.7
|
6 years ago |
|
Emard
|
f9e4c8f0e3
|
PCB v2.1.7: new footprints for R,C and LED with rounded pads
|
6 years ago |
|
Emard
|
86ae55de96
|
license renamed back to "LICENSE.md" as github didnt recognized this
|
6 years ago |
|
Emard
|
ccdbfcd9ff
|
readme update
|
6 years ago |
|
Emard
|
3ac8ce31c6
|
license file renamed to LICENSE
|
6 years ago |
|
Emard
|
70377d515f
|
readme update
|
6 years ago |
|
Emard
|
d4149df792
|
license "original location" "the original location"
|
6 years ago |
|
Emard
|
669ba9927a
|
readme update
|
6 years ago |
|
Emard
|
9930943c27
|
license added
|
6 years ago |
|
Emard
|
b1c9f15fa9
|
BOM: 1-click-bom update (D18 didn't appear with DigiKey PN)
|
6 years ago |
|
Emard
|
8c65b6782a
|
BOM v2.1.6
|
6 years ago |
|
Emard
|
74fbb486e6
|
schematics: updating LowCost fields
|
6 years ago |
|
Emard
|
0da92617ef
|
gerbers v2.1.6
|
6 years ago |
|
Emard
|
dfcd39ecf4
|
PCB v2.1.6: trac cosmetix around SDRAM
|
6 years ago |
|
Emard
|
114ffb1896
|
gerbers update: SDRAM pads
|
6 years ago |
|
Emard
|
2f6f450ce3
|
PCB: updated SDRAM footprint and trac cosmetix
|
6 years ago |
|
Emard
|
09e6053392
|
footprints: SDRAM pads enlarged length 0.9->1.1 mm, square->oval and
moved away from chip by 0.2 mm for easier handsoldering
|
6 years ago |
|
Emard
|
9797208194
|
gerbers update: adc silkscreen cosmetix
|
6 years ago |
|
Emard
|
59c3943ce9
|
PCB: adc silkscreen cosmetix
|
6 years ago |
|
Emard
|
2336a24ab5
|
footprints: adc silkscreen cosmetix
|
6 years ago |
|
Emard
|
7a0823c3f9
|
gerbers update: dipswitch and adc silkscreen
|
6 years ago |
|
Emard
|
c7e9196ce2
|
PCB: updating dipswitch and adc silkscreen
|
6 years ago |
|
Emard
|
d261114e21
|
footprints: dipswitch silkscreen cosmetix
|
6 years ago |
|
Emard
|
8b24b6e4f6
|
footprints: adc silkscreen cosmetix: moving the dot
|
6 years ago |
|
Emard
|
8b1cbf1a70
|
gerbers update
|
6 years ago |
|
Emard
|
9848db7076
|
PCB: update footprints for ADC and USBSERIAL
grid origin to lower left edge of PCB
|
6 years ago |
|
Emard
|
94357f52b7
|
footprints: oval pads for ADC and USBSERIAL, only pad 1 squared
usbserial pads enlarged by 0.1mm towards the chip
|
6 years ago |
|
Emard
|
49db26aeea
|
gerbers update
|
6 years ago |
|
Emard
|
90f43a53b8
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
013e73e351
|
gerbers v2.1.5
|
6 years ago |
|
Emard
|
91a831541e
|
PCB v2.1.5: ADC land pattern pads distance now 4.68 mm
|
6 years ago |
|
Emard
|
131bd8391e
|
footprints: max1112x pads distance reduced to 4.68 mm according to land pattern 90-0023
|
6 years ago |
|
Emard
|
f2c2ff7c82
|
readme update
|
6 years ago |
|
Emard
|
c14d0effb3
|
readme update
|
6 years ago |
|
Emard
|
2b6e9aceb7
|
readme update
|
6 years ago |
