Emard
|
a043e882cc
|
PCB: updated values for C56, C57
|
6 years ago |
Emard
|
1f5e9a10b7
|
PCB: further separating RV2 from RV3
|
6 years ago |
Emard
|
b621862a68
|
PCB: RV3 enabled 3D model and insertion coordinates
|
6 years ago |
Emard
|
5103a78486
|
PCB v1.9.4: silkscreen cosmetix
|
6 years ago |
Emard
|
ae20ff2331
|
PCB: more space between RV2 and RV3
|
6 years ago |
Emard
|
c98c7c136b
|
PCB: silkscreen cosmetix
|
6 years ago |
Emard
|
4c36281509
|
PCB: BAT1 pad size enlarged 0.2 mm and pad clearance set to 0.7 mm
|
6 years ago |
Emard
|
b706f87913
|
PCB v1.9.2: load capacitors for 32768 Hz
|
6 years ago |
davor
|
2f232fed27
|
PCB: silkscreen cosmetix
|
6 years ago |
davor
|
c142a36a20
|
PCB: using properly rotated battery holder
|
6 years ago |
davor
|
4f68b6dd2c
|
PCB v1.9.1
|
7 years ago |
davor
|
8e2fbd718a
|
PCB: v1.9
|
7 years ago |
Emard
|
f33e8e7491
|
PCB v1.8.14: moving Y1 25MHz oscillator down, away from screw hole
and silkscreen cosmetix
|
7 years ago |
Emard
|
1ba56909c8
|
PCB: fix selection of parts for insertion
|
7 years ago |
Emard
|
6dd13fe09e
|
PCB v1.8.12
|
7 years ago |
Emard
|
a9abb85a26
|
PCB: revert ESP32 DAC to Audio Jack L/R
|
7 years ago |
Emard
|
d446ceed90
|
PCB: ESP32 DAC to Audio Jack L/R
|
7 years ago |
Emard
|
f7f8809bc6
|
PCB: update
|
7 years ago |
Emard
|
185360489e
|
PCB update
|
7 years ago |
Emard
|
c01b7ef399
|
PCB: US2_ID to WAKEUPn
|
7 years ago |
Emard
|
0d59b3ad29
|
PCB: update
|
7 years ago |
Emard
|
bf4425d32c
|
PCB: silkscreen cosmetix
|
7 years ago |
Emard
|
dc0f3a4d4a
|
PCB: J3 correctly rotated
|
7 years ago |
Emard
|
53d368cea7
|
PCB: SDRAM new footprint, dot for pin 1 for SW1 and ADC
|
7 years ago |
Emard
|
0d7f573f00
|
PCB v1.8.11
|
7 years ago |
Emard
|
81c498c9ae
|
PCB: new footprints SOIC-8 and silkscreen cosmetix
|
7 years ago |
davor
|
f9a38e1998
|
PCB: silkscreen moving "KONCAR" to the left for better visual effect
|
7 years ago |
davor
|
afb4ea253f
|
PCB: "inem" logo update
|
7 years ago |
davor
|
f1f0d7ade2
|
PCB: "inam" logo update
|
7 years ago |
davor
|
7bdb1880da
|
PCB: larger FER logo (4.6 mm height)
|
7 years ago |
Emard
|
46ee5bcf86
|
PCB: KONCAR logo
|
7 years ago |
Emard
|
de076784b4
|
PCB: update for USB footprint
|
7 years ago |
Emard
|
0ad4f5d633
|
PCB v1.8.10
|
7 years ago |
Emard
|
c89e08b31c
|
PCB: revert USB default footprint
|
7 years ago |
davor
|
a1e758b705
|
PCB: flash chip use combo 150/208 mil footprint
|
7 years ago |
davor
|
49bf3b64cc
|
PCB: silkscreen cosmetics, moving texts around for visibility
|
7 years ago |
davor
|
0671e14733
|
PCB: spacing RV2 RV3 away from 2.54 mm thru-holes
|
7 years ago |
davor
|
d5ec90d78f
|
PCB: separate RV2 RV3 for soldermask to enter inbetween
|
7 years ago |
davor
|
8f4e6ffc42
|
PCB: Q1, Q2 non-handsoldering footprint
|
7 years ago |
davor
|
d0275f9cef
|
PCB: USB diodes and jumpers with smaller (non-handsoldering) pads
|
7 years ago |
davor
|
a38926d559
|
PCB: moving C1, C21, C50 away from J1, J2 connectors
|
7 years ago |
davor
|
2e357a510c
|
PCB: 3D model of IDC 2.54mm headers
|
7 years ago |
Emard
|
ea89e1c3d9
|
PCB: battery holder 3D model in place
|
7 years ago |
davor
|
9196448978
|
PCB: 3D models for HDMI and audio jack
|
7 years ago |
davor
|
383913bf97
|
PCB: trac cosmetix
|
7 years ago |
davor
|
e13cab6d5f
|
PCB: moving US2 VIAs from under the footprint to the front of solder pads.
Better to avoid any chance of short circuit with connector shell.
|
7 years ago |
davor
|
be3ef7a678
|
PCB v1.8.9
|
7 years ago |
davor
|
78e398513c
|
PCB: track cosmetix around US2 and copper pour
|
7 years ago |
davor
|
46709c1772
|
PCB: 3D view replaced didoes with 0-ohm resistors
|
7 years ago |
davor
|
00ed12e81d
|
PCB v1.8.8
|
7 years ago |