Emard
|
2f284399db
|
PCB v2.1.17: Silkscreen cosmetix
text "SDRAM" moved away from pads
text "R56" moved from top to bottom side, where it belongs
|
6 years ago |
|
Emard
|
46802103bf
|
gerbers v2.1.16: sdram pads length 1.1->1.2 mm
|
6 years ago |
|
Emard
|
d2506bad02
|
PCB v2.1.16: SDRAM pads length 1.1->1.2 mm
|
6 years ago |
|
Emard
|
106dce5b39
|
footprints: SDRAM pad length 1.1->1.2 mm
|
6 years ago |
|
Emard
|
0cc832ec7f
|
gerbers v2.1.15
|
6 years ago |
|
Emard
|
65512e8323
|
PCB v2.1.15: rounded pads for PCB jumpers, BGA thermal management
|
6 years ago |
|
Emard
|
3acab2e27e
|
footprints: rounded pads for PCB jumpers
|
6 years ago |
|
Emard
|
104f26be65
|
box: OLED opening 2mm down
|
6 years ago |
|
Emard
|
6167ff10f4
|
box: centering rings on bottom side to avoid screw force and brekaing
|
6 years ago |
|
Emard
|
047429cb65
|
box: oled stand update for new board
|
6 years ago |
|
Emard
|
1fa87a1cf0
|
gerbers v2.1.14
|
6 years ago |
|
Emard
|
aaa8f530d1
|
PCB v2.1.14: thermal management and trac cosmetix
|
6 years ago |
|
Emard
|
7ae2ac5f0b
|
gerbers v2.1.12
|
6 years ago |
|
Emard
|
247db8b329
|
PCB v2.1.12: thermal management (Zec suggestions)
|
6 years ago |
|
Emard
|
a3c97140c2
|
gerbers v2.1.11: thermal management
|
6 years ago |
|
Emard
|
5680223e2d
|
PCB v2.1.11: thermal management
|
6 years ago |
|
Emard
|
050ee7e029
|
gerbers update
|
6 years ago |
|
Emard
|
65320e230f
|
PCB: thermal management around RV2 RV3
|
6 years ago |
|
Emard
|
398469dc21
|
BUM 2.1.10 update
|
6 years ago |
|
Emard
|
88b9f29187
|
schematics 2.1.10: Flash pull up resistors R11 R12 R27 R28 15k -> 10k
|
6 years ago |
|
Emard
|
6389204a16
|
gerbers update
|
6 years ago |
|
Emard
|
7305ea83ba
|
PCB: silkscreen cosmetix R11 R12
|
6 years ago |
|
Emard
|
d2d7275be5
|
gerbers v2.1.10
|
6 years ago |
|
Emard
|
a68c9789de
|
PCB v2.1.10: thernal management against tombstoning
|
6 years ago |
|
Emard
|
01c84700b8
|
readme update
|
6 years ago |
|
Emard
|
04d0c95036
|
gerbers v2.1.9
|
6 years ago |
|
Emard
|
e4addde457
|
PCB v2.1.9: move VIAs out of pads under BGA
update R56 as virtual to not appear in fabrication placement list
copper fill keepout on jumpers
trac cosmetix
|
6 years ago |
|
Emard
|
b92a15489b
|
footprints: BGA rename fiducial pads 0->X (as 0 is usually gnd)
|
6 years ago |
|
Emard
|
9099c7f928
|
PCB: ADC silkscreen dot update
|
6 years ago |
|
Emard
|
c322f6029d
|
footprints: ADC moving dot to better visible location (pin-1 marker)
|
6 years ago |
|
Emard
|
a45244fd95
|
gerbers v2.1.8
|
6 years ago |
|
Emard
|
9b841adea0
|
readme update
|
6 years ago |
|
Emard
|
df8154be45
|
PCB v2.1.8: BGA chip alignment fiducials, ft231x reduced row distance
|
6 years ago |
|
Emard
|
18379d51a8
|
footprints: BGA with fiducial pads for chip alignment
|
6 years ago |
|
Emard
|
47a0e3576a
|
footprints: ft231x reduce distance of 2 rows to 5.4 mm
|
6 years ago |
|
Emard
|
f65f243c92
|
readme update
|
6 years ago |
|
Emard
|
93f6aa5836
|
box: centering 3-led view slit
|
6 years ago |
|
Emard
|
3eabc3d722
|
PCB: ft231x enlarged silkscreen outline
|
6 years ago |
|
Emard
|
b8251359ae
|
footprints: ft231x enlarged silkscreen outline
|
6 years ago |
|
Emard
|
3f374a7860
|
gerbers update
|
6 years ago |
|
Emard
|
3f4842a718
|
PCB: balancing thermal relief on both SMD pads of R,C in attempt to prevent tombstoning
|
6 years ago |
|
Emard
|
861d10f7ad
|
gerbers v2.1.7
|
6 years ago |
|
Emard
|
f9e4c8f0e3
|
PCB v2.1.7: new footprints for R,C and LED with rounded pads
|
6 years ago |
|
Emard
|
86ae55de96
|
license renamed back to "LICENSE.md" as github didnt recognized this
|
6 years ago |
|
Emard
|
ccdbfcd9ff
|
readme update
|
6 years ago |
|
Emard
|
3ac8ce31c6
|
license file renamed to LICENSE
|
6 years ago |
|
Emard
|
70377d515f
|
readme update
|
6 years ago |
|
Emard
|
d4149df792
|
license "original location" "the original location"
|
6 years ago |
|
Emard
|
669ba9927a
|
readme update
|
6 years ago |
|
Emard
|
9930943c27
|
license added
|
6 years ago |
